Stacked circuit board architecture in an electronic device

ABSTRACT

A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to (i) U.S. ProvisionalApplication No. 62/398,037, filed on Sep. 22, 2016, and titled “DISPLAYMODULE & GLASS WITH UNDERCUT PLASTIC FRAME”; (ii) U.S. ProvisionalApplication No. 62/398,045, filed on Sep. 22, 2016, and titled “BATTERYARCHITECTURE IN AN ELECTRONIC DEVICE”; (iii) U.S. ProvisionalApplication No. 62/398,059, filed on Sep. 22, 2016, and titled “STACKEDMLB ARCHITECTURE IN AN ELECTRONIC DEVICE”; (iv) U.S. ProvisionalApplication No. 62/398,065, filed on Sep. 22, 2016, and titled “CLOSEDAUDIO MODULE IN AN ELECTRONIC DEVICE”; (v) U.S. Provisional ApplicationNo. 62/398,069, filed on Sep. 22, 2016, and titled “THERMAL DISTRIBUTIONASSEMBLY IN AN ELECTRONIC DEVICE”; and (vi) U.S. Provisional ApplicationNo. 62/557,090, filed on Sep. 11, 2017, and titled “PORTABLE ELECTRONICDEVICE”, the disclosure of each is incorporated herein by reference inits entirety.

FIELD

The following description relates to electronic devices. In particular,the following relates to an electronic device that includes a circuitboard assembly. The circuit board assembly can include one or morecircuit boards, with at least one circuit board stacked over and incommunication with another circuit board.

BACKGROUND

An electronic device may include a circuit board that holds severalintegrated circuits. As electronic device capabilities increase,additional integrated circuits are required. This requires additionalcircuit board space. However, by increasing the circuit boarddimensions, other components must decrease in order to fit the circuitboard within the electronic device. For example, the battery may requirea reduced dimension, which leads to lower charge storage capacity of thebattery.

SUMMARY

In one aspect, a circuit board assembly for an electronic device isdescribed. The circuit board assembly may include a first circuit boardhaving a first mounting surface. The circuit board assembly may furtherinclude a first operational component located on the first mountingsurface. The first operational component may include a recess. Thecircuit board assembly may further include a second circuit boardelectrically coupled to the first circuit board. The second circuitboard may include a second mounting surface. The circuit board assemblymay further include a second operational component located on the secondmounting surface. The second operational component may include aprotrusion. In some embodiments, the first circuit board is positionedwith respect to the second circuit board such that the protrusion atleast partially extends into the recess.

In another aspect, an electronic device is described. The electronicdevice may include an enclosure that defines an internal volume. Theelectronic device may include a circuit board assembly disposed in theinternal volume. The circuit board assembly may include a first circuitboard that carries a first operational component on a first surface. Thefirst circuit board may further carry a second operational component ona second surface that is opposite the first surface. The circuit boardassembly may further include a second circuit board overlaid by thefirst circuit board. The second circuit board may carry a thirdoperational component on a third surface that faces the second surface.The circuit board assembly may further include a first shielding elementthat covers the first circuit board and provides a first electromagneticinterference (EMI) shield for the first operational component. Thecircuit board assembly may further include a second shielding elementpositioned between the first circuit board and the second circuit board.The second shielding element may provide a second EMI shield for thesecond component.

In another aspect, a method for forming a circuit board assembly isdescribed. The method may include providing a first circuit board thatincludes a first operational component. The first operational componentmay include a recess. The method may further include securing a secondcircuit board with the first circuit board such that the first circuitoverlays the second circuit board. The second circuit board may includea second operational component that includes a protrusion. The methodmay further include positioning the protrusion in the recess.

Other systems, methods, features and advantages of the embodiments willbe, or will become, apparent to one of ordinary skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description and this summary, bewithin the scope of the embodiments, and be protected by the followingclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 illustrates a front isometric view of an embodiment of anelectronic device, in accordance with some described embodiments;

FIG. 2 illustrates a rear isometric view of the electronic device shownin FIG. 1, further showing additional features of the electronic device;

FIG. 3 illustrates a partial exploded view of the electronic deviceshown in FIG. 1, showing various components of the electronic device;

FIG. 4 illustrates a partial exploded view of the electronic deviceshown in FIG. 1, further showing additional components of the electronicdevice;

FIG. 5 illustrates a cross sectional view of the electronic device shownin FIG. 1, taken along line A-A in FIG. 1;

FIG. 6 illustrates a cross sectional view of an alternate embodiment ofan electronic device, in accordance with some described embodiments;

FIG. 7 illustrates a cross sectional view of the electronic device shownin FIG. 1, taken along line B-B in FIG. 1;

FIG. 8 illustrates a cross sectional view of an alternate embodiment ofan electronic device, in accordance with some described embodiments;

FIG. 9 illustrates a plan view of an embodiment of a frame, inaccordance with some described embodiments;

FIG. 10 illustrates a cross sectional view of the frame shown in FIG. 9taken along line A-A;

FIG. 11 illustrates a cross sectional view of an alternate embodiment ofa frame, showing a surface of the frame having protruding features, inaccordance with some described embodiments;

FIG. 12 illustrates a cross sectional view of an embodiment of anelectronic device, showing the electronic device having a frame and asupporting element partially embedded in the frame and extendingsubstantially into the frame;

FIG. 13 illustrates a cross sectional view of an embodiment of anelectronic device, showing the electronic device having a protectivecover and a sidewall component that is extended to provide additionalsupport for the protective cover, in accordance with some describedembodiments;

FIG. 14 illustrates a cross sectional view of an embodiment of anelectronic device, showing the electronic device having variousstructural enhancements, in accordance with some described embodiments;

FIG. 15 illustrates a plan view of an embodiment of an electronicdevice, showing a plate positioned in an enclosure of the electronicdevice, in accordance with some described embodiments;

FIG. 16 illustrates a partial side view of the electronic device shownin FIG. 15, further showing the first extension of the plate securedwith a display assembly;

FIG. 17 illustrates a cross sectional view of an embodiment of anelectronic device, showing the electronic device with an enclosure and asupport structure integrally formed with the enclosure, in accordancewith some described embodiments;

FIG. 18 illustrates a plan view of an embodiment of a protective cover,in accordance with some described embodiments;

FIG. 19 illustrates a cross sectional view of the protective cover shownin FIG. 18 taken along line B-B, further showing the a notch formed inthe protective cover;

FIG. 20 illustrates a cross sectional view of an embodiment of anelectronic device, showing the protective cover (shown in FIGS. 18 and19) secured with an enclosure, in accordance with some describedembodiments;

FIG. 21 illustrates a cross sectional view of an embodiment of anelectronic device, showing a protective cover extending over a frame andpositioned proximate to a sidewall component, in accordance with somedescribed embodiments;

FIG. 22 illustrates an exploded view of the battery, in accordance withsome described embodiments;

FIG. 23 illustrates a plan view of the first electrode shown in FIG. 22;

FIG. 24 illustrates a plan view of an alternate embodiment of anelectrode suitable for use in a battery assembly, in accordance withsome described embodiments;

FIG. 25 illustrates a plan view of an alternate embodiment of anelectrode suitable for use in a battery assembly, in accordance withsome described embodiments;

FIG. 26 illustrates a plan view of an alternate embodiment of anelectrode suitable for use in a battery assembly, in accordance withsome described embodiments;

FIG. 27 illustrates an embodiment of a battery in an electronic device,with the battery having a shape that accommodates an internal componentof the electronic device, in accordance with some described embodiments;

FIG. 28 illustrates an alternate embodiment of a battery assembly in anelectronic device, with the battery assembly having a shape thataccommodates multiple internal components of the electronic device, inaccordance with some described embodiments;

FIG. 29 illustrates an alternate embodiment of a battery assembly in anelectronic device, with the battery assembly having an opening thataccommodates an internal component of the electronic device, inaccordance with some described embodiments;

FIG. 30 illustrates an alternate embodiment a battery assembly in anelectronic device, with the battery assembly positioned in an enclosure(of the electronic device) over a first internal component of theelectronic device, in accordance with some described embodiments;

FIG. 31 illustrates a cross sectional view of the electronic deviceshown in FIG. 30, taken along line C-C in FIG. 30;

FIG. 32 illustrates an exploded view of the circuit board assembly shownin FIG. 4, in accordance with some described embodiments;

FIG. 33 illustrates a cross sectional view of the circuit board assemblyshown in FIG. 32, showing various internal components of the circuitboard assembly;

FIG. 34 illustrates an alternative embodiment of a circuit boardassembly, showing the circuit board assembly modified for ingressprotection;

FIG. 35 illustrates an alternate embodiment of a circuit board assembly,showing the circuit board assembly having a flexible circuitelectrically coupled with the circuit boards of the circuit boardassembly, in accordance with some described embodiments;

FIG. 36 illustrates a cross sectional view of the circuit board assemblyshown in FIG. 35, showing the flexible circuit extending between thecircuit boards;

FIG. 37 illustrates a cross sectional view of an alternate embodiment ofa circuit board assembly, showing internal components of the circuitboard assembly having corresponding geometries, in accordance with somedescribed embodiments;

FIG. 38 illustrates a cross sectional view of an alternate embodiment ofa circuit board assembly, showing the circuit board assembly havingseveral solder masks used to support a circuit board, an accordance withsome described embodiments;

FIG. 39 illustrates an isometric view of an embodiment of an audiomodule, in accordance with some described embodiments;

FIG. 40 illustrates a cross sectional view of the audio module shown inFIG. 39, taken along line D-D in FIG. 39, showing several internalfeatures;

FIG. 41 illustrates a cross sectional view of the electronic device,showing the audio module positioned in the electronic device;

FIG. 42 illustrates an exploded view of a thermal distribution assembly,in accordance with some described embodiments;

FIG. 43 illustrates a partial cross sectional view of the electronicdevice shown in FIG. 1, showing the thermal distribution assemblypositioned in the electronic device;

FIG. 44 illustrates a side view of an alternative embodiment of athermal distribution assembly, in accordance with some describedembodiments;

FIG. 45 illustrates an isometric view of an alternative embodiment of athermal distribution assembly, showing the thermal distribution assemblymodified to receive a component, in accordance with some describedembodiments;

FIG. 46 illustrates an isometric view of an alternative embodiment of athermal distribution assembly, in accordance with some describedembodiments;

FIG. 47 illustrates a flowchart showing a method for forming a displayassembly for an electronic device, in accordance with some describedembodiments;

FIG. 48 illustrates a flowchart showing a method for forming a batteryassembly for an electronic device, in accordance with some describedembodiments;

FIG. 49 illustrates a flowchart showing a method for method for forminga circuit board assembly, in accordance with some described embodiments;

FIG. 50 illustrates a flowchart showing a method for assembling anelectronic device that includes an enclosure that defines an internalvolume, in accordance with some described embodiments; and

FIG. 51 illustrates a flowchart showing a method for making a thermaldistribution assembly for removing heat from a heat-generating componentin an electronic device having an enclosure sidewall, in accordance withsome described embodiments.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following disclosure relates to an electronic device. The electronicdevice may include several enhancements over traditional devices. Forexample, the electronic device may include an enclosure that defines aninternal volume of the electronic device. The electronic device mayfurther include a display that extends to the enclosure in at least somelocations, thereby increasing the size of the display. The display maybe part of a display assembly that further includes a touch sensitivelayer and a force sensitive layer. In order to accommodate the increaseddisplay size, the electronic device may include a border (or frame)surrounding the display, with the frame having a decreased size.However, without certain modifications, the reduced size of the bordermay expose electrical and mechanical connections between the displayassembly components and flexible circuits (in the electronic device). Inthis regard, some components of the display assembly may be electricallyand mechanically coupled with their respective circuitry (includingflexible circuits) in different locations throughout the electronicdevice so as to hide the electrical and mechanical connections fromview. For example, the touch sensitive layer and the display mayelectrically and mechanically couple with their respective circuitry atone location inside the electronic device, while the force sensitivelayer electrically and mechanically couples with circuitry at adifferent location away from the electrical and mechanical connectionsbetween the touch sensitive layer, the display, and their respectiveflexible circuits. Also, by routing the electrical and mechanicalconnections in different locations, the volume occupied by the displayassembly (and its components) can be reduced, and additional room in theinternal volume of the electronic device is available for use by adifferent component(s) in the electronic device.

The electronic device may further include a circuit board assemblydesigned to occupy less space in the electronic device. For example, thecircuit board assembly may be divided into a first circuit board stackedover a second circuit board. A stacked configuration of multiple circuitboards (one stacked over the other) may reduce the footprint of thecircuit board assembly in two dimensions, thereby providing additionalspace for other components and/or a battery assembly with an increasedsize. Also, the aforementioned circuit boards may include operationalcomponents (such as integrated circuits or processor circuits)positioned on multiple, opposing surfaces. Also, the circuit boardassembly may include several interposers, or interconnects, designed tocarry signals between the first and second circuit boards, such that thefirst and second circuit boards (as well as their respective operationalcomponents) are in communication with one another.

In some instances, the stacked circuit board assembly may include anoperational component (located on one of the circuit boards) thatincludes a recess and an additional operational component (located onone of the other circuit board) that includes a protrusion (orprotruding feature) that is partially positioned in the recess. In thismanner, the circuit boards can be positioned closer together based onthe recess receiving a portion of the additional operational component,thereby further reducing the footprint of the stacked circuit boardassembly. Further, in some instances, the operational components mayelectrically couple with one another. For example, the recess mayinclude a connector and the protrusion may include a connector thatelectrically couples to the connector of the recess. As a result of theelectrical connection between the operational components, the circuitboards may also be in electrical communication with each other. This mayreduce the requirements for separate and dedicated electrical connectorsused to electrically couple the circuit boards.

The electronic device may further include a battery assembly, orinternal power supply. Due in part to the modifications to the displayassembly and the circuit board assembly that create additional space inthe enclosure, the battery assembly may increase in size and occupy atleast some of the additional space, thereby increasing the chargecapacity of the battery assembly. Furthermore, the battery assembly mayinclude a shape other than a traditional rectilinear shape. For example,the battery assembly may include an L-shaped configuration formed by diecutting several electrodes in a L-shaped configuration, similar to thatof the battery assembly, to form the battery assembly. Also, additionalcomponents, such as antennae and circuits, may be repositioned in theelectronic device in order to increase the size of the battery assembly.In addition, the battery assembly may include modifications, such as achannel, designed to accommodate a flexible circuit routed across thebattery assembly, and in particular, across the channel.

Also, in some instances, the enclosure may include a metal band thatcouples with a transparent protective layer (such as a cover glass) thatcovers the display assembly. The metal band may include a metal such asaluminum, or a metal alloy that includes aluminum. The enclosure mayfurther include an additional protective layer coupled with the metalband. The additional protective layer may include a non-metal material,such as glass, sapphire, plastic, or the like. The additional protectivelayer may substantially define a rear or bottom wall of the electronicdevice. Accordingly, the ability of the enclosure to distribute anddissipate heat from the electronic device may be limited, as an amountof metal used for the enclosure is limited to the metal band, and glassincludes a significantly lower thermal conductivity as compared to thatof the metal that forms the metal band.

When one or more components (such as integrated circuits) in theelectronic device generate heat, it may be necessary to remove the heatfrom the internal volume to avoid damage to a component (or components)in the electronic device. In this regard, the electronic device mayinclude a thermal distribution assembly disposed against or near theadditional protective layer. The thermal distribution assembly isdesigned to dissipate (or redistribute) thermal energy generated fromthe heat-generating component(s) to the metal band, allowing the thermalenergy to dissipate from the electronic device. The thermal distributionassembly may include several layers of metal, one of which may include arelatively high thermal conductivity (as compared to the remaininglayers). Accordingly, the electronic device may include an enclosurewith a bottom wall made of glass, which may improve the overallaesthetics of the electronic device, while also having the ability toremove heat from the electronic device before the temperature inside theelectronic device increases and causes damage to any of the internalcomponents of the electronic device. Moreover, the layers of relativelylow thermal conductivity may prevent heat transfer to the glass bottomwall, thereby preventing or limiting thermal energy reaching a user ofthe electronic device while holding the electronic device.

Also, when a user interacts with the display assembly, the forcesensitive layer may determine an amount of force exerted on the displayin order to generate a command in accordance with the amount ofdetermined force. However, the force applied to the display assembly (byway of the protective layer that covers the display assembly) may bendthe display assembly and the protective layer, thereby reducing theinternal volume and increasing the internal air pressure. The increasedinternal air pressure may affect other components, such as an audiomodule designed to generate acoustical energy. In order to shield theaudio module from increased air pressure, the audio module may include ahousing, or enclosure, that encloses the components of the audio module,including a back volume of the audio module, and provides a shield fromthe air in the internal volume of the electronic device, andaccordingly, shields the back volume of the audio module from pressurechanges in the electronic device. In this manner, the audio module isunaffected from pressure changes in the electronic device and generatesacoustical energy without disturbances from the pressure changes.

These and other embodiments are discussed below with reference to FIGS.1-51. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates a front isometric view of an embodiment of anelectronic device 100, in accordance with some described embodiments. Insome embodiments, the electronic device 100 is a tablet computer device.In other embodiments, the electronic device 100 is a wearable electronicdevice that includes one or more straps (not shown) designed to wraparound an appendage (such as a wrist) of a user to secure the electronicdevice 100 with the user. In the embodiment shown in FIG. 1, theelectronic device 100 is a mobile communication device, such as asmartphone. Accordingly, the electronic device 100 may enable wirelesscommunication in the form of cellular network communication, Bluetoothcommunication (2.4 GHz), and/or wireless local area network (WLAN)communication (2.4 GHz to 5 GHz), as non-limiting examples. As shown,the electronic device 100 may include a display assembly 102 thatincludes a display layer designed to present visual information in theform of textual information, still images, and/or video information.Although not shown, the display assembly 102 may further include a touchsensitive layer designed to detect a touch input to the display assembly102 in order to, for example, control the information presented on thedisplay assembly 102. Also, the display assembly 102 may further includea force sensitive layer designed to detect an amount of force applied tothe display assembly 102. The determined amount of force may correspondto a particular input or command to a processor circuit (not shown) thatcontrols the display assembly 102. For example, different detectedamounts of force may correspond to different or distinct commands.

In order to protect the display assembly 102, the electronic device 100may include a first protective layer 104 that overlays the displayassembly 102. A second protective layer (not shown) of the electronicdevice 100 will be shown and discussed below. The first protective layer104 may include a transparent material(s), including glass, sapphire, orplastic, as non-limiting examples. As shown, the first protective layer104 may include openings that facilitate user interaction with theelectronic device 100. For example, the first protective layer 104 mayinclude a first opening 106 and a second opening 108. The electronicdevice 100 may include an image capture device (not shown) that capturesan image (or images) through the first opening 106. The electronicdevice 100 may further include an audio module (not shown) thatgenerates acoustical energy in the form of audible sound, which exitsthe electronic device 100 via the second opening 108.

Also, the electronic device 100 may include a band 110 that defines anouter perimeter of the electronic device 100. Generally, the band 110includes a shape similar to that of a 4-sided ring. However, othershapes are possible. Also, the band 110 may define multiple sidewallsand an opening to at least partially receive and secure with the firstprotective layer 104 and a second protective cover (not shown). In someembodiments, the band 110 includes a metal, such as aluminum or an alloythat includes aluminum. In this regard, the band 110 may provide a rigidsupport structure for the electronic device 100. Also, when the band 110is formed from a metal, the band 110 may be used to support wirelesscommunication. For example, the band 110 may include a first sidewallcomponent 112 that forms a U-shape design, as well as a second sidewallcomponent 114 that also forms a U-shape design. The first sidewallcomponent 112 and the second sidewall component 114 may each function inconjunction with a radio circuit (not shown) in the electronic device100 such that the first sidewall component 112 and the second sidewallcomponent 114 each form at least part of an antenna for their respectiveradio circuits. For example, the first sidewall component 112 mayfunction in conjunction with a WLAN radio circuit, and the secondsidewall component 114 may function in conjunction with a cellularnetwork radio circuit.

Also, the band 110 may further include a third sidewall component 116and a fourth sidewall component 118, with the third sidewall component116 and the fourth sidewall component 118 separated from both the firstsidewall component 112 and the second sidewall component 114 by splitregions, or openings. For example, the band 110 may include a firstsplit region 122 and a second split region 124 that combine to separatethe third sidewall component 116 from the first sidewall component 112and the second sidewall component 114. Also, the band 110 may include athird split region 126 and a fourth split region 128 that combine toseparate the fourth sidewall component 118 from the first sidewallcomponent 112 and the second sidewall component 114. The aforementionedsplit regions may be filled with a non-metal material, such as moldedplastic (or other non-electrically conductive material), to provide aflush, co-planar surface with the various parts of the band 110. Withthe first sidewall component 112 and the second sidewall component 114being electrically isolated from the third sidewall component 116 andthe fourth sidewall component 118, the first sidewall component 112 andthe second sidewall component 114 may function as part of an antenna,while the third sidewall component 116 and the fourth sidewall component118 may function as an electrical ground for one or more internalcomponents (not shown) that are electrically coupled with the thirdsidewall component 116 and the fourth sidewall component 118,respectively. Also, each of the first sidewall component 112, the secondsidewall component 114, the third sidewall component 116, and the fourthsidewall component 118 may provide a protective structural component forat least some internal components, as well as provide thermaldissipation and heat removal for some heat-generating components (notshown) of the electronic device 100, provided the heat-generatingcomponents are thermally coupled with at least one of the aforementionedparts. Also, the first sidewall component 112, the second sidewallcomponent 114, the third sidewall component 116, and the fourth sidewallcomponent 118 may each represent at least a portion of first sidewall, asecond sidewall, a third sidewall, and a fourth sidewall, respectively.

The electronic device 100 may further include one or more input devices.For example, the electronic device 100 includes a first button 130designed to generate an input when depressed. The input may generate anelectrical signal sent to a processor circuit (not shown) in theelectronic device 100, in order to alter the visual informationpresented on the display assembly 102. As shown, the first button 130 islocated along the third sidewall component 116. However, other locationsare possible. Also, although not shown, the electronic device 100 mayinclude a switch designed to provide an additional user input function.

Also, the electronic device 100 may further include a data port 132designed to receive and electrically couple with a cable assembly (notshown). The data port 132 may receive data/communication from the cableassembly, as well as electrical energy to charge a battery assembly (notshown) located in the electronic device 100. Also, the electronic device100 may include additional openings designed for various userinteractions. For example, the electronic device 100 may an audio module(not shown) located near openings 134, or through holes, formed in thesecond sidewall component 114. The openings 134 allow acoustical energygenerated from the audio module to exit the electronic device 100. Also,the electronic device 100 may further include a microphone (not shown)located near an opening 136, or through hole, formed in the secondsidewall component 114. The microphone may be positioned to receiveacoustical energy through the opening 136.

FIG. 2 illustrates a rear isometric view of the electronic device 100shown in FIG. 1, further showing additional features of the electronicdevice 100. As shown, the electronic device 100 may include a secondprotective layer 144 secured with the band 110. The second protectivelayer 144 may combine with the band 110 to define an enclosure thatincludes an internal volume, or cavity, that receives several internalcomponents, such as circuit boards, integrated circuits, and a batteryassembly, as non-limiting examples. In this regard, the band 110 mayinclude a first edge region that receives the first protective layer 104(shown in FIG. 1), as well as a second edge region that receives thesecond protective layer 144, with the first edge region and the secondedge region in opposite, or opposing, locations of the band 110. Also,the second protective layer 144 may be referred to as a bottom wall orback wall.

Generally, the second protective layer 144 may include a material (ormaterials) that provides an aesthetic finish, such as glass, sapphire,or plastic. Also, in some instances, the material makeup of the secondprotective layer 144 may allow radio frequency (“RF”) communication,generated from internal radio circuits (not shown) of the electronicdevice 100, to permeate through the second protective layer 144. In thismanner, the electronic device 100 may be in wireless communication withother devices (not shown) by way of RF communication that issubstantially uninhibited by the second protective layer 144.

Also, the second protective layer 144 may include openings thatfacilitate user interaction with the electronic device 100. For example,the second protective layer 144 may include a first opening 146 and asecond opening 148. The electronic device 100 may include an imagecapture device (not shown) that captures an image (or images) throughthe first opening 146. The electronic device 100 may further include aflash module (not shown) aligned with the second opening 148, with theflash module generating light energy passing through the second opening148 during an image capture event from the image capture device in orderto enhance image quality of the image(s) taken by the image capturedevice. Also, in addition to the first button 130 (shown in FIG. 1), theelectronic device 100 may further include a second button 150 designedto generate an input when depressed, in a manner similar to that for thefirst button 130. As shown, the second button 150 is located along thefourth sidewall component 118. However, other locations are possible.

FIG. 3 illustrates a partial exploded view of the electronic device 100shown in FIG. 1, showing various components of the electronic device100. Several features of the electronic device 100 are not shown forpurposes of simplicity. As shown, the first protective layer 104 mayoverlay the display assembly 102. Also, the first protective layer 104may adhesively secure with the display assembly 102 by an adhesive layer(not shown).

As shown, the display assembly 102 may include a touch sensitive layer202 designed to receive a touch input, a display layer 204 designed topresent visual information, and a force sensitive layer 206 designed todetect an amount of force applied to, or exerted on, the display layer204 by way a force applied to at least one of the first protective layer104, the touch sensitive layer 202, and the display layer 204. Also,although not shown, the display assembly 102 may include adhesive layersto adhesively secure the touch sensitive layer 202 with the displaylayer 204, and to adhesively secure the display layer 204 with the forcesensitive layer 206.

The touch sensitive layer 202 is designed to receive a touch input when,for example, a user (not shown) depresses the first protective layer104. The touch sensitive layer 202 may include capacitivetouch-sensitive technology. For example, the touch sensitive layer 202may include a layer of capacitive material that holds an electricalcharge. The layer of capacitive material is designed to form a part ofmultiple capacitive parallel plates throughout a location correspondingto the display layer 204. In this regard, when a user touches the firstprotective layer 104, the user forms one or more capacitors. Moreover,the user causes a volt drop across the one or more capacitors, which inturns causes the electrical charge of the capacitive material to changeat a specific point (or points) of contact corresponding to a locationof the user's touch input. The capacitance change and/or voltage dropcan be measured by the electronic device 100 to determine the locationof the touch input. Also, the touch sensitive layer 202 may include anedge region 226 that includes a connector (shown later).

In some embodiments, the display layer 204 includes a liquid crystaldisplay (“LCD”) that relies upon backlighting to present the visualinformation. In the embodiment shown in FIG. 3, the display layer 204includes an organic light emitted diode (“OLED”) display designed toilluminate individual pixels, when needed. When the display layer 204includes OLED technology, the display layer 204 may include a reducedform factor as compared to that of an LCD display. In this regard, thedisplay assembly 102 may include a smaller footprint, thereby creatingmore space for other components such as a battery assembly (shownlater). Furthermore, when the display layer 204 includes OLEDtechnology, the display layer 204 can curve or bend without causingdamage to the display layer 204. For example, as shown in FIG. 3, thedisplay layer 204 includes a bend 208. The bend 208 may include a180-degree bend, or approximately 180-degree bend. The bend 208 allowsthe display layer 204 to bend or curve around at least a portion of theforce sensitive layer 206, as shown in FIG. 3. Also, the display layer204 may include an edge region 210 that includes a connector (not shown)used to electrically and mechanically couple the display layer 204 witha flexible circuit (not shown) that electrically couples with a circuitboard assembly (shown below), with flexible circuit placing the displaylayer 204 in communication with the circuit board assembly. Also, insome embodiments, the display layer 204 may include an active matrixorganic light emitting diode (“AMOLED”) display. Also, as shown in FIG.3, the edge region 226 of the touch sensitive layer 202 is parallel, orat least substantially parallel, with respect to the edge region 210 ofthe display layer 204, even when the display layer 204 includes the bend208.

The force sensitive layer 206 may operate by determining an amount offorce or pressure applied to the first protective layer 104, the touchsensitive layer 202, and/or the display layer 204. In this regard, theforce sensitive layer 206 may distinguish between different amounts offorce applied to the electronic device 100. The different amounts offorce may correspond to different user inputs. The force sensitive layer206 may include multiple parallel capacitor plate arrangements, with oneplate of each capacitor plate arrangement having an electrical charge.When a force to the first protective layer 104 causes the distancebetween one or more pairs of parallel plate capacitor to reduce, achange in capacitance between the one or more pairs of parallel platecapacitor may occur. The amount of change in capacitance corresponds toan amount of force exerted on the first protective layer 104. Also, asshown in the enlarged view, the force sensitive layer 206 may include aconnector 218 located on an edge region 220 of the force sensitive layer206, with the edge region 220 perpendicular, or at least substantiallyperpendicular, with respect to the edge region 210 of the display layer204 and the edge region 226 of the touch sensitive layer 202.Accordingly, the connector 218 can be positioned perpendicular, or atleast substantially perpendicular, with respect to the connector (shownlater) of the display layer 204.

Further, in order to support the first protective layer 104 andfacilitate assembly of the first protective layer 104 with the band 110(shown in FIG. 1), the electronic device 100 may include a frame 154that receives and secures with the first protective layer 104 by anadhesive layer 166. Accordingly, the frame 154 may include a size andshape in accordance with that of the first protective layer 104. Theframe 154 may be positioned at least partially between the firstprotective layer 104 and the band 110. The frame 154 may be formed froma polymeric material, such as plastic, and may also include a metal ring(not shown) that is partially embedded in the polymeric material duringan insert molding operation. In this regard, the frame 154 maystructurally support the first protective layer 104, as well as one ormore components of the display assembly 102. This will be shown below.

FIG. 4 illustrates a partial exploded view of the electronic device 100shown in FIG. 1, further showing additional components of the electronicdevice 100. Several features of the electronic device 100 are not shownfor purposes of simplicity. As shown, the band 110 and the secondprotective layer 144 may combine to provide an internal volume 152 forseveral internal components. For example, the electronic device 100 mayinclude a battery assembly 160 designed to distribute electrical currentto operational components of the electronic device 100. The batteryassembly 160 may include a rechargeable battery designed to receiveelectrical current during a recharge. For example, the electronic device100 may include an inductive receiver coil 162 (formed from a metal,such as steel) electrically coupled to the battery assembly 160. Theinductive receiver coil 162, when placed in proximity to an alternatingmagnetic field from a device (not shown) external to the electronicdevice, may receive an induced electrical current from the alternatingmagnetic field. The induced electrical current from the inductivereceiver coil 162 passes through a transformer to convert alternatingcurrent to direct current, which is then used to charge (or recharge)the battery assembly 160. Also, the second protective layer 144 provideslittle or no impedance to the external magnetic field so that thealternating magnetic field reaches the inductive receiver coil 162.

Also, the battery assembly 160 may further include a channel 164 thatincludes a reduced dimension (in the z-dimension in Cartesiancoordinates, for example), thereby allowing a component, such as aflexible circuit (not shown), to extend along the battery assembly 160and pass over the battery assembly 160 along the channel 164. Due inpart to the increase space provided by the channel 164, other internalcomponents, such as an antenna element (not shown), can be repositionedin the internal volume 152 of the electronic device 100, therebycreating create additional space for the battery assembly 160. In thismanner, the volume (size) of the battery assembly 160 may increase, andthe increased volume allows the battery assembly 160 to increaseelectrical storage capacity such that the electronic device 100 providesa longer usage of the electronic device 100 between charging events ofthe battery assembly 160.

The electronic device 100 may further include a circuit board assembly170 that includes multiple operational components. As shown, the circuitboard assembly 170 may include a first circuit board 172 and a secondcircuit board 174, with the first circuit board 172 stacked over thesecond circuit board 174. In this manner, the circuit board assembly 170can conserve space, in the x- and y-dimensions, in the internal volume152. Also, the first circuit board 172 and the second circuit board 174may include multiple surfaces, with each of the multiple surfacesdesigned to carry one or more components (such as processor circuits).The various features of the circuit board assembly 170 will be discussedbelow.

The electronic device 100 may further include a first audio module 182and a second audio module 184, both of which are designed to generateacoustical energy in the form of audible sound. Each of the audiomodules may include an opening to emit acoustical energy. However, eachaudio module is designed to include an acoustical volume (defined bytheir respective audio modules) that is isolated from the internalvolume 152 of the electronic device 100. In this manner, when theinternal volume 152 changes by, for example, depressing and bending thefirst protective layer 104 (shown in FIG. 3) to provide a touch inputand/or a force input to the electronic device 100, the audio modules arenot affected (acoustically) from the change in the internal volume 152,and associated increased air pressure in the internal volume 152. Thiswill be further discussed below.

The electronic device 100 may further include a thermal distributionassembly 190. Although not shown, the thermal distribution assembly 190may include several layers of material. In some embodiments, the layersof material differ. For example, some layers are formed from a firsttype material, while other layers are formed from a second type materialdifferent than the first type material. The first type material mayinclude a material having a relatively high thermal conductivity. As anexample, the first type material may include copper, known to include athermal conductivity of approximately 400 W/m*K (Watts per meter perKelvin degree). Alternatively, the first type may include graphite knownto include a thermal conductivity of approximately 170 W/m*K.Accordingly, the first type material is well suited to receive thermalenergy and transfer or distribute the thermal energy from one locationin the electronic device 100 to another location, thereby facilitatingremoval of the thermal energy from the electronic device 100. The secondtype material may include a more robust material, such as stainlesssteel. In this regard, the second type material may include a relativelylower thermal conductivity. However, the second type material mayprovide 1) a protective cover for the first type material, 2) structuralsupport for the electronic device 100, and/or 3) a workable surface tosecure a component (not shown) with the thermal distribution assembly190 by, for example, a welding operation. The various layers of thethermal distribution assembly 190 will be further described below.

The thermal distribution assembly 190 is designed to redirect orredistribute heat generated in the electronic device 100. For example,the circuit board assembly 170 may include operational components, suchas integrated circuits, known to convert electrical energy (supplied bythe battery assembly 160) into thermal energy during operation. Thethermal distribution assembly 190 can be thermally coupled with thecircuit board assembly 170 by contact between the thermal distributionassembly 190 and the circuit board assembly 170, as a non-limitingexample. Also, the thermal distribution assembly 190 may be thermallycoupled with the band 110 such that thermal energy received by thethermal distribution assembly 190 from the circuit board assembly 170may at least partially transfer to the band 110. Accordingly, at leastsome thermal conductivity lost by using the second protective layer 144(a non-metal) is regained by using the thermal distribution assembly190. Also, the thermal distribution assembly 190 may include a size andshape in accordance with the second protective layer 144 such thatthermal distribution assembly 190 covers, or at least substantiallycovers, a surface of the second protective layer 144. For example, thex- and y-dimensions of the thermal distribution assembly 190 may be thesame, or substantially similar, to the x- and y-dimensions,respectively, of the second protective layer 144.

Although not shown, the electronic device 100 may include additionalcomponents, such a haptic engine and internal antennae, as non-limitingexamples. Also, although not shown, the electronic device 100 mayinclude several flexible circuits that place the electronic components(e.g., display assembly 102, circuit board assembly 170) in electricalcommunication with one another as well as the battery assembly 160.

FIG. 5 illustrates a cross sectional view of the electronic device 100shown in FIG. 1, taken along line A-A in FIG. 1. As shown, the layer ofthe display assembly 102—the touch sensitive layer 202, the displaylayer 204, and the force sensitive layer 206—are assembled. Although notshown, the display assembly 102 may include adhesive layers toadhesively secure the touch sensitive layer 202 with the display layer204, and to adhesively secure the display layer 204 with the forcesensitive layer 206.

The touch sensitive layer 202 is designed to receive a touch input when,for example, a user (not shown) depresses the first protective layer104. The touch input can be relayed from the touch sensitive layer 202to the circuit board assembly 170 (shown in FIG. 4) by a first flexiblecircuit 212 electrically and mechanically coupled with the touchsensitive layer 202 by a connector 222 of the touch sensitive layer 202.The connector 222 can be located on an edge region 226 (shown in FIG. 3)of the touch sensitive layer 202. As shown, the first flexible circuit212 may bend or curve around the display layer 204 and the forcesensitive layer 206 to electrically and mechanically couple with touchsensitive layer 202.

The frame 154 may include design considerations that accommodate thedisplay assembly 102. For example, the frame 154 may include a notch156, or undercut region, designed to at least partially receive thefirst flexible circuit 212 and/or the display layer 204. As shown inFIG. 5, the notch 156 includes a size and shape to receive a bent/curvedregion of both the display layer 204 as well the first flexible circuit212. While the notch 156 includes a curvature generally corresponding tothat of the first flexible circuit 212 and the display layer 204, othershapes, including straight edges, are possible for the notch 156. Also,the notch 156 may be formed during a molding operation of the frame 154.Alternatively, the notch 156 may be formed subsequent to a moldingoperation by, for example, a cutting operation.

Also, the frame 154 is adhesively secured with the first protectivelayer 104 and the second sidewall component 114 (of the band 110, shownin FIG. 1) by adhesive layers (not labeled). The frame 154 may include asupporting element 158 partially embedded in the frame 154. In someembodiments, the supporting element 158 includes a ring formed from ametal material that continuously extends around the display assembly 102in accordance with the frame 154. However, the supporting element 158may also be discontinuous, and accordingly, may be selectively embeddedin the frame 154. As shown, the supporting element 158 may extend alongthe frame 154 to support the display assembly 102 and the firstprotective layer 104. Also, the first flexible circuit 212 mayadhesively secure with the supporting element 158 by an adhesive layer(not labeled).

FIG. 5 further shows the some components of the display assembly 102coupled with the flexible circuits at one location while othercomponents are not. For example, the touch sensitive layer 202 iselectrically and mechanically coupled with the first flexible circuit212 by the connector 222, and the display layer 204 is electrically andmechanically coupled with a second flexible circuit 214 by a connector224, with the connector 222 and the connector 224 located proximate tothe second sidewall component 114 (defined by a U-shape configuration,as shown in FIG. 1). The connector 218 (shown in FIG. 3) of the forcesensitive layer 206 is located along a different edge region of theforce sensitive layer 206 (see FIG. 3). Moreover, the connector 222 andconnector 224 electrically and mechanically coupled with the firstflexible circuit 212 and the second flexible circuit 214, respectively,at a location proximate to the notch 156 in the frame 154, while theforce sensitive layer 206 is not. In addition, the connector 222 may bepositioned parallel, or at least substantially parallel, with respect tothe connector 224. The force sensitive layer 206 may electrically andmechanically couple to a flexible circuit (not shown) in anotherseparate location (such as the connector 218 on the edge region 220,shown in FIG. 3). This will be shown and described below.

FIG. 6 illustrates a cross sectional view of an alternate embodiment ofan electronic device 250, in accordance with some described embodiments.The electronic device 250 may include any feature(s) or component(s)previously described for an electronic device. For example, theelectronic device 250 may include a display assembly 252 that includes atouch sensitive layer 262, a display layer 264, and a force sensitivelayer 266. However, as shown in FIG. 6, the display layer 264 mayinclude a substantially flat configuration throughout the display layer264, with a flexible circuit 274 bending around the force sensitivelayer 266 to electrically and mechanically couple with the display layer264.

FIG. 7 illustrates a cross sectional view of the electronic device 100shown in FIG. 1, taken along line B-B in FIG. 1. As shown, the connector218 (also shown in FIG. 3) of the force sensitive layer 206 electricallyand mechanically couples the force sensitive layer 206 with a thirdflexible circuit 216 that electrically couples with the circuit boardassembly 170 (shown in FIG. 4) to place the force sensitive layer 206 incommunication with the circuit board assembly 170. Also, the thirdflexible circuit 216 may adhesively secure with the supporting element158 by an adhesive layer (not labeled).

As shown in FIG. 7, only the force sensitive layer 206 includes anelectrical and mechanical connection with a flexible circuit. In otherwords, the connector 218 that provides the electrical and mechanicalconnection between the force sensitive layer 206 and the third flexiblecircuit 216 is in a different location of the electronic device 100, ascompared to the connector 222 (shown in FIG. 5) of the touch sensitivelayer 202 and the connector 224 (shown in FIG. 5) of the display layer204. Also, based on the locations of the respective edge regions, theconnector 218 of the force sensitive layer 206 is positionedperpendicular, or at least substantially perpendicular, with respect tothe connector 222 of the touch sensitive layer 202 and the connector 224of the display layer 204.

Further, the connector 218 is proximate to the third sidewall component116 (also shown in FIG. 1), which is defined in part a sidewall that isperpendicular, or approximately perpendicular, to a portion of thesecond sidewall component 114 (shown in FIGS. 1 and 5). As a result, theframe 154 may not require a notch 156 (shown in FIG. 5) to accommodatethe display layer 204 and the first flexible circuit 212 (shown in FIG.5). Accordingly, the frame 154 may include an asymmetrical frame.Moreover, the additional material of the frame 154 may allow foradditional structural rigidity to support the display assembly 102 andthe first protective layer 104.

FIG. 8 illustrates a cross sectional view of an alternate embodiment ofan electronic device 300, in accordance with some described embodiments.The electronic device 300 may include any feature(s) or component(s)previously described for an electronic device. For example, theelectronic device 300 may include a first protective layer 304 securedwith a display assembly 302, and a frame 354 that carries the firstprotective layer 304. However, the first protective layer 304 mayinclude an extension 306 that at least partially extends radiallyoutward from the first protective layer 304 in a circumferential manner.In order to accommodate the extension 306, the frame 354 may include anotch 366 that receives the extension 306. The extension 306 providesthe first protective layer 304 with an additional structural profile,and can also provide additional surface area to adhesively bond thefirst protective layer 304 with the frame 354. For example, as shown inFIG. 8, the first protective layer 304 is adhesively secured with theframe 354 by an adhesive layer 362 that extends through a region definedin part by an interface between the frame 354 and the first protectivelayer 304, including the extension 306. Also, the distance or gapbetween the frame 354 and the first protective layer 304 (including theextension 306) may cause the adhesive layer 362 to extend through theinterface region by capillary forces. As a result, the frame 354 isadhesively secured with the first protective layer 304 by multiple(perpendicular) surfaces in order to form a stronger adhesive bond thatcounters or offsets forces to the electronic device 300 in multipledirections.

FIG. 9 illustrates a plan view of an embodiment of a frame 454, inaccordance with some described embodiments. As shown, the frame 454 mayinclude a supporting element 458, which may include a metal ring moldedinto the frame 454. The frame 454 may be implemented into one or more ofthe electronic devices described herein, and may include any featurespreviously described for a frame. In order to improve adhesion forcesbetween an adhesive (not shown) and a surface 462 of the frame 454, thesurface 462 may include certain modifications. For example, as shown inthe enlarged view, the surface 462 may include a textured region 464designed to increase the surface tension, or surface energy, of thesurface 462. The textured region 464 may enhance an adhesive bondbetween the frame 454 and a transparent cover (such as the firstprotective layer 104 shown in FIG. 5) by an adhesive (such as theadhesive layer 166 shown in FIG. 5).

FIG. 10 illustrates a cross sectional view of the frame 454 shown inFIG. 9 taken along line A-A. As shown, the textured region 464 mayinclude multiple dimples or divots formed into the frame 454 along thesurface 462. The textured region 464 provides additional surface areafor the aforementioned adhesive. Several different processes may be usedto form the textured region 464. For example, a molding tool (not shown)used to mold the frame 454 may include protruding features that includea shape corresponding to the shape of the textured region 464.Alternatively, the frame 454 may be formed with a molding tool that doesnot include the protruding features, and subsequent to the moldingoperation that forms the frame 454, the surface 462 can be etched by alaser, for example, to form the textured region 464. Also, while thetextured region 464 defines several dimples or divots formed into theframe 454, several shapes other than dimples or divots are possible. Forexample, the textured region 464 may include several indentations,linear and/or non-linear.

FIG. 11 illustrates a cross sectional view of an alternate embodiment ofa frame 554, showing a surface 562 of the frame 554 having protrudingfeatures 564, in accordance with some described embodiments. The frame554 may include any features previously described for a frame. In thisregard, the surface 562 may be used to receive a transparent cover (suchas the first protective layer 104 shown in FIG. 5) by an adhesive (suchas the adhesive layer 166 shown in FIG. 5). As shown, the protrudingfeatures 564 may extend from the surface 562. The frame 554, and inparticular, the protruding features 564, may be formed by a molding tool(not shown) that includes inserts designed to draw out some of themolding material (used to form the frame 554), thereby causing theprotruding features 564 to extend from the surface 562. The protrudingfeatures 564 provide additional surface area for the aforementionedadhesive.

FIG. 12 illustrates a cross sectional view of an embodiment of anelectronic device 700, showing the electronic device 700 having a frame754 and a supporting element 758 partially embedded in the frame 754 andextending substantially into the frame 754. The electronic device 700may include any features described herein for an electronic device.Also, similar to a prior embodiment, the supporting element 758 mayinclude a ring formed from a metal material that extends around adisplay assembly 702 of the electronic device 700 and in accordance withthe frame 754. As shown, the supporting element 758 may extend, in az-dimension, beyond the display assembly 702 and also beyond aprotective cover 704 (similar to the first protective layer 104 shown inFIG. 1).

In order to extend the supporting element 758 further in thez-dimension, the frame 754 may be widened in the y-dimension. Also, thedimensions of a sidewall component 714 (similar to the second sidewallcomponent 114 shown in FIG. 1) of the electronic device 700 can bereduced in the y-dimension to offset the increased dimension of theframe 754. Further, the material(s) that form the frame 754 may bealtered to accommodate the supporting element 758. For example, theframe 754 may include a nylon material mixed with a glass fillermaterial that enhances the overall strength and rigidity of the frame754. However, in some embodiments, the frame 754 is formed from ceramic.In this regard, the sidewall component 714, as well as any remainingsidewall components, may also be formed from ceramic.

When the supporting element 758 is extended in a manner described, otherfactors should be taken into consideration. For example, in someinstances, the sidewall component 714 forms part of an antenna assembly(not shown) that includes an antenna component designed to providewireless communication for the electronic device 700. The supportingelement 758, when formed from a metal, may cause some interference withthe antenna component. This may include forming a parallel platecapacitor between the antenna assembly (including the sidewall component714) and the supporting element 758. Accordingly, the size, shape,material, and position of the supporting element 758 should beconsidered in order to prevent unwanted interference. It should be notedthat additional techniques can used to optimize the size of thesupporting element 758 the proximity to the sidewall component 714. Thismay include, for example, reducing the z-dimension of the supportingelement 758 and/or provide openings, or discontinuities, in thesupporting element 758.

The electronic device 700 may include a surface 762 that receives, andadhesively combines with, the protective cover 704. The surface 762 mayinclude a dimension 766 that provides a generally flat surface. However,in some embodiments, the surface 762 is modified to enhance the adhesivebond with the protective cover 704. Also, the frame 754 may include anotch 756, or undercut, formed into the frame 754 that allows the frame754 to receive the display assembly 702, including flexible circuits andflexible layers of the display assembly 702. The notch 756 can beresized (increased, for example) based upon the increased dimension ofthe frame 754. However, by increasing the size (in the y-dimension) ofthe notch 756, additional material of the frame 754 may be removed in alocation below the surface 762. It should be noted that additionaltechniques are be used to optimize the size of the notch 756 with thedimension 766 of the surface 762.

Also, in order to secure the frame 754 with the sidewall component 714,the electronic device 700 may include an adhesive 768 that bonds theframe 754 to the sidewall component 714. As shown, the amount ofadhesive 768 used generally allows the sidewall component 714, the frame754, and the protective cover 704 to form a generally continuous andplanar configuration, as denoted by the edges of the aforementionedparts being aligned with one another. However, in order to provideadditional protection to the protective cover 704 by the sidewallcomponent 714, the amount of adhesive 768 used can be reduced, causingthe protective cover 704 to lower in the z-dimension with respect to thesidewall component 714. In this manner, the sidewall component 714 mayadditionally cover part of the protective cover 704 and provideadditional protection to the protective cover 704 from forces having aforce component the y-dimension. It should be noted that additionaltechniques can used to optimize the amount of adhesive 768 used as wellas adjust the size of the frame 754, the sidewall component 714, and theprotective cover 704 in order to maintain the generally continuous andplanar configuration.

FIG. 13 illustrates a cross sectional view of an embodiment of anelectronic device 800, showing the electronic device 800 having aprotective cover 804 and a sidewall component 814 that is extended toprovide additional support for the protective cover 804, in accordancewith some described embodiments. The electronic device 800 may includeany features described herein for an electronic device. As compared toprior embodiments, the sidewall component 814 includes an outerperimeter 824 that is raised or elevated in the z-dimension. As aresult, the material (in the y-dimension) forming the sidewall component814 increases and provides additional support for the protective cover804. Further, the sidewall component 814 may include an edge 826 that isparallel, or at least substantially parallel, with respect to a surface806 of the protective cover 804. As a result, the sidewall component 814may further provide additional support to the protective cover 804 and aframe 854 between the protective cover 804 and the sidewall component814.

FIG. 14 illustrates a cross sectional view of an embodiment of anelectronic device 900, showing the electronic device 900 having variousstructural enhancements, in accordance with some described embodiments.The electronic device 900 may include any features described herein foran electronic device. Similar to prior embodiments, the electronicdevice 900 may include a display assembly 902 that includes a touchsensitive layer 912 designed to receive a touch input, a display layer914 designed to present visual information, and a force sensitive layer916 designed to detect an amount of force applied to, or exerted on, thedisplay layer 914 by way a force applied to at least one of the touchsensitive layer 912, the display layer 204, and a protective cover 904that overlays the display assembly 902. The display assembly 902 mayfurther include a plate 918 secured to the force sensitive layer 916. Asshown, the plate 918 is below the force sensitive layer 916. However, insome embodiments (not shown), the plate 918 is positioned between thedisplay layer 914 and the force sensitive layer 916.

The plate 918 may include a rigid material, such as metal or plastic.The plate 918 may provide structural support and stiffness to thedisplay assembly 902. As a result, the plate 918 may shield the displayassembly 902 from impact due to another component (not shown) in theelectronic device 900 when the electronic device 900 is dropped. Also,the plate 918 may prevent bending of the layers of the display assembly902, which in turn may prevent the layers from overcoming adhesive bondsand peeling away from each other.

In some embodiments, an electronic device includes a flexible circuitcoupled to a touch input layer. In order to limit movement of theflexible circuit, an adhesive is applied to a supporting element(embedded in a frame) to adhere the flexible circuit with the supportingelement. However, the adhesive is known to shrink upon curing. Theshrinking effect of the adhesive may provide a pulling force to theflexible circuit, which in turn causes an unwanted pulling force toother components, which may alter the position of some components oreven damage some components.

Generally, the amount of shrinking of the adhesive (from an uncuredstate to a cured state) depends on the amount of adhesive used. In orderto reduce the pulling force caused by shrinking, electronic devices maybe modified to limit the amount of adhesive required. For example, FIG.14 shows the electronic device 900 having a plate 928 positioned betweena flexible circuit 922 (similar to the first flexible circuit 212 shownin FIG. 5) and a supporting element 958 embedded in a frame 954. Theplate 928 can be positioned between the supporting element 958 and anadhesive 930 disposed on the supporting element 958. The plate 928 mayinclude a metal plate used as a shim that can be secured to the flexiblecircuit 922. The plate 928 may occupy space between the flexible circuit922 and the supporting element 958 that would otherwise be occupied bythe adhesive 930. In this manner, an amount of adhesive 930 used can bereduced, and accordingly, the shrinking effect caused by the adhesive930 is also reduced. Also, the plate 928 is designed and positioned toabsorb some forces that would otherwise impact the display assembly 902.As a result, the plate 928 may limit or prevent visual issues, such asdisplay artifacts, when the display assembly 902 is on and is presentingvisual information.

Similar to prior embodiments, the display layer 914 extends beyond theforce sensitive layer 916 and includes a bend. However, as shown in FIG.14, the display layer 914 may include a first material 932 covering asurface of the display layer 914. The first material 932 may include apotting material that protects the display layer 914, and in particularthe bent region of the display layer 914, from external forces. In orderto supply the first material, a needle (not shown) can be inserted intoa location within the bend region of the display layer 914. The needlecan disperse the material while being pulled out of the electronicdevice 900.

The display layer 914 may further include a second material 934 coveringa surface of the display layer 914 include several metal traces (notlabeled). The second material 934 is designed to provide a compressionforce to the metal traces, and prevent tension forces from acting on themetal traces, thereby preventing damage to the metal traces. Also, thesecond material 934 may provide stiffness and structural support to thedisplay layer 914.

FIG. 15 illustrates a plan view of an embodiment of an electronic device1000, showing a plate 1018 positioned in an enclosure 1010 of theelectronic device 1000, in accordance with some described embodiments.For purposes of illustration, several features—including a transparentcover and a display assembly—are removed. The electronic device 1000,the enclosure 1010, and the plate 1018 may include any featuresdescribed herein for an electronic device, an enclosure, and a plate,respectively. The plate 1018 is designed for use with a display assembly(now shown). In this regard, the plate 1018 may include any featurespreviously described for the plate 918 (shown in FIG. 14).

The plate 1018 may include a notch 1020 designed to receive part of adisplay assembly. As an example, the notch 1020 may receive the bendingregions of a display assembly (similar to the display assembly 102,shown in FIG. 5) and/or flexible circuits (such as the first flexiblecircuit 212, shown in FIG. 5) associated with the display assembly. Inother words, the bending regions associated with the display assemblymay bend around the plate 1018 along a planar edge 1022 of the plate1018 and avoid contacting the enclosure 1010. Accordingly, the notch1020 may be referred to as a cut out region of the plate 1018.

Additionally, the plate 1018 may include extensions, such as a firstextension 1024 and a second extension 1026. As shown, the firstextension 1024 and the second extension 1026 extend beyond a planar edge1028 of the plate 1018. A display assembly (not shown) may includebending regions and flexible circuits that bend around the planar edge1028 in a manner previously described, and can be positioned between thefirst extension 1024 and the second extension 1026. The first extension1024 and the second extension 1026 expand the plate 1018 in they-dimension. In this manner, an external force applied to the electronicdevice 1000 with a force component in the y-dimension may cause theplate 1018 (and a display assembly carried by the plate 1018) to shiftrelative to the enclosure 1010 in the y-dimension. However, the firstextension 1024 and the second extension 1026 are designed to engage asidewall component 1014 (similar to the second sidewall component 114shown in FIG. 1) of the enclosure 1010 prior to the bending regions ofthe display assembly and/or flexible circuits engaging the enclosure1010. As a result, damage and/or electrical disconnections of thedisplay assembly may be prevented.

FIG. 16 illustrates a partial side view of the electronic device 1000shown in FIG. 15, further showing the first extension 1024 of the plate1018 secured with a display assembly 1002. As shown, the displayassembly 1002 may curve around the plate 1018. Also, the plate 1018 mayextend laterally, in the y-dimension, beyond the display assembly 1002and a frame 1054 that secures a protective cover 1004 over the displayassembly 1002. As a result, the first extension 1024 and the secondextension 1026 (shown in FIG. 15) may combine to provide a buffer forthe display assembly 1002 against a force applied to the displayassembly 1002 that causes the display assembly to move toward thesidewall component 1014 of the enclosure 1010 (labeled in FIG. 15). Theframe 1054, the protective cover 1004, and the display assembly 1002 mayinclude any features previously described for a frame, a protectivecover, and a display assembly, respectively.

FIG. 17 illustrates a cross sectional view of an embodiment of anelectronic device 1100, showing the electronic device 1100 with anenclosure 1110 and a support structure 1120 integrally formed with theenclosure 1110, in accordance with some described embodiments. Forpurposes of simplicity, some features and components of the electronicdevice 1100 are not shown. However, the electronic device 1100 and theenclosure 1110 may include any features described herein for anelectronic device and an enclosure, respectfully. Unlike priorembodiments of an electronic device having a frame that secures to anenclosure, the support structure 1120 can be part of the enclosure 1110.In some embodiments, the enclosure 1110 is formed from a metal, such asaluminum or an alloy that includes aluminum. In the embodiment shown inFIG. 17, the enclosure 1110 is formed from ceramic. A ceramic materialmay provide a robust housing while also minimizing the effects of RFinterference with an antenna assembly (not shown) of the electronicdevice 1100.

The support structure 1120 can receive and support a protective cover1104 (similar to the first protective layer 104 shown in FIG. 1). Also,the support structure 1120 may include a notch 1156 designed to receivebending regions of a display assembly 1102 and/or bending regions of aflexible circuit 1112 used with the display assembly 1102. The notch1156 may extend circumferentially around the display assembly 1102.Accordingly, the notch 1156 may be integrated into the enclosure 1110.This may reduce the associated costs and manufacturing times associatedwith the use of a frame.

FIG. 18 illustrates a plan view of an embodiment of a protective cover1204, in accordance with some described embodiments. The protectivecover 1204 may include any features described herein for a protectivecover and/or a protective layer. Accordingly, the protective cover 1204may include a transparent material, such as glass, sapphire, plastic, orthe like. In this regard, the protective cover 1204 is designed tooverlay a display assembly (not shown). The protective cover 1204 mayinclude a base portion and a notch (shown below) defined in part by adotted line 1206.

FIG. 19 illustrates a cross sectional view of the protective cover 1204shown in FIG. 18 taken along line B-B, further showing a notch 1208formed in the protective cover 1204. The notch 1208 may define a cavitythat extends partially into the material that forms the protective cover1204. In this manner, the notch may receive, or at least partiallyreceive, a display assembly. This will be further shown below. Also, theprotective cover 1204 may include a base portion 1212 that extendsaround the notch 1208.

FIG. 20 illustrates a cross sectional view of an embodiment of anelectronic device 1200, showing the protective cover 1204 (shown inFIGS. 18 and 19) secured with an enclosure 1210, in accordance with somedescribed embodiments. For purposes of simplicity, some features andcomponents of the electronic device 1200 are not shown. However, theelectronic device 1200 may include any features described herein for anelectronic device. As shown, the electronic device 1200 may include adisplay assembly 1202 secured to the protective cover 1204, andpositioned in the notch 1208. The display assembly 1202 may partiallyfit into the notch 1208, or may fully fit into the notch 1208, dependingupon the desired configuration. By fitting the display assembly 1202into the notch 1208 of the protective cover 1204, the protective cover1204 may increase the protection provided to the display assembly 1202by covering multiple dimensions of the display assembly 1202. As aresult, impact forces to the electronic device 1200 may be absorbed, orat least partially absorbed, by the protective cover 1204 prior to anyimpact to the display assembly 1202. Also, by modifying the protectivecover 1204, the design modifications to other components may be limited,which reduces manufacturing and engineering costs. Also, the frame 1254may not require a notch (such as the notch 156, shown in FIG. 5), andaccordingly, may provide additional support to the protective cover1204.

FIG. 21 illustrates a cross sectional view of an embodiment of anelectronic device 1300, showing a protective cover 1304 extending over aframe 1354 and positioned proximate to a sidewall component 1314, inaccordance with some described embodiments. The electronic device 1300,the sidewall component 1314, and the frame 1354 may include any featuresdescribed herein for an electronic device, a sidewall component, and aframe, respectively. As shown, the frame 1354 can be modified andreduced in size to allow the protective cover 1304 to extend over theframe 1354 and border the sidewall component 1314. This allows theprotective cover 1204, and in particular a curved portion 1306 of theprotective cover 1304, to receive direct protection from the sidewallcomponent 1314, as opposed to the frame 1354 extending between thesidewall component 1314 and the protective cover 1304 (as shown in otherembodiments). Also, the protective cover 1304 may define an extendedprotective cover having a relatively greater length in the y-dimension.This may allow for modification to the display assembly 1302 of theelectronic device 1300 to also increase in size in the y-dimension.Alternatively, or in combination, the extended length of the protectivecover 1304 and the display assembly 1302 may promote asymmetric-appearing display assembly, which may also allow formodification to a display frame (not shown) that partially covers thesymmetric-appearing display assembly. By providing a display assemblythat is symmetric, the overall appearance of the electronic device 1300may be enhanced.

FIG. 22 illustrates an exploded view of the battery assembly 160, inaccordance with some described embodiments. As shown, the batteryassembly 160 may include a first cover element 1402 and a second coverelement 1404, with the first cover element 1402 sealed with the secondcover element 1404 to form a housing that shields the internalcomponents of the battery assembly 160. The housing formed by the firstcover element 1402 and the second cover element 1404 may define a cavityto receive and enclose internal components. For example, the batteryassembly 160 may further include a first electrode 1406 and a secondelectrode 1408 separate from the first electrode 1406 (such that each ofthe first electrode 1406 and the second electrode 1408 include a singlepiece electrode), with a separator 1410 that provides some physicalisolation between the first electrode 1406 and the second electrode1408, while still allowing the flow of electrical charge between thefirst electrode 1406 and the second electrode 1408. As commonly known inthe art for a battery, one of the first electrode 1406 and the secondelectrode 1408 includes an anode, while the remaining electrode (of thefirst electrode 1406 and the second electrode 1408) includes a cathode.Also, as commonly known, electrodes can be used to convert chemicalenergy into electricity for use by an electronic device (such as theelectronic device 100, shown in FIG. 1). Further, the battery assembly160, and battery assemblies described herein, may include a rechargeablebattery assembly designed for reuse subsequent to the battery assembly160 receiving electrical energy from an external source. The batteryassembly 160 may further include a circuit board 1412 that includes oneor more circuits designed to monitor electrical current flowing into andout of the battery assembly 160. Also, the circuit board 1412, as wellas components of the circuit board 1412, may be in electricalcommunication with the circuit board assembly 170 (shown in FIG. 4).

Also, the first cover element 1402 may form a channel 164 that providesadditional space, in the z-dimension, for a component (not shown), suchas a flexible circuit. In other words, a dimension (such as the height)of the battery assembly 160 is reduced in a location corresponding tothe channel 164, while still providing ample room for the circuit board1412 to be positioned below the channel 164. In this manner, thecomponent may be positioned across the channel 164, thereby allowing arearrangement of other components in the electronic device 100 (shown inFIG. 1) to create additional room for the battery assembly 160. As aresult, the battery assembly 160 may include a large size, whichcorresponds to greater charge capacity. While the first cover element1402 and the second cover element 1404 may provide a shield, includingan electrical shield, the aforementioned cover elements may allow forsome electrical connections. For example, the first cover element 1402may include an opening 1414 proximate to the circuit board 1412. Also,although not shown, the first cover element 1402 and/or the second coverelement 1404 may include an additional opening to allow an additionalcomponent (or components) to electrically couple with the batteryassembly 160. While traditional battery electrodes include a generallyrectilinear shape, the electrodes in the battery assembly 160, andbattery assemblies described herein, may include different shapes. Forexample, as shown in FIG. 22, the first electrode 1406 and the secondelectrode 1408 include an “L-shaped configuration,” in which at leastone surface include six different sides. This will be further discussedbelow.

FIG. 23 illustrates a plan view of the first electrode 1406 shown inFIG. 22. As shown, the first electrode 1406 includes L-shapedconfiguration. In this regard, the first electrode 1406 may include afirst part 1420, or first rectangular portion, and a second part 1422,or second rectangular portion, extending from the first part 1420. Thedotted line denotes an interface region between the first part 1420 andthe second part 1422. In some embodiments (not shown), the size of thefirst part 1420 is the same as, or substantially similar to, the secondpart 1422. However, in the embodiment shown in FIG. 23, the size of thefirst part 1420 is greater than that of the second part 1422.

The first electrode 1406 may also be characterized as including a firstwall 1434 having a first dimension 1444, and a second wall 1436 having asecond dimension 1446. As shown, the first wall 1434 is parallel, or atleast substantially parallel, with respect to the second wall 1436, andthe second dimension 1446 is less than the first dimension 1444. Also,the first electrode 1406 may include a third wall 1438 (separating thefirst wall 1434 from the second wall 1436) having a third dimension1448, and a fourth wall 1440 having a fourth dimension 1450. As shown,the third wall 1438 is parallel, or at least substantially parallel,with respect to the fourth wall 1440, and the fourth dimension 1450 isless than the third dimension 1448. Further, the first electrode 1406may include a fifth wall 1442 parallel, or at least substantiallyparallel, with respect to the third wall 1438. The fifth wall 1442 mayinclude a fifth dimension 1452 that is less than the third dimension1448. As shown in FIG. 23, the fourth dimension 1450 and the fifthdimension 1452 may combine to equal the third dimension 1448. Also, thethird wall 1438 is perpendicular, or at least substantiallyperpendicular, with respect to the first wall 1434 and the second wall1436. In some embodiments (not shown), the first dimension 1444 is thesame as the second dimension 1446. Still, in some embodiments (notshown), the first dimension 1444 is less than the second dimension 1446.Also, it should be noted that the second electrode 1408 (shown in FIG.22), and any additional electrode(s) and separator(s) included in thebattery assembly 160 (shown in FIG. 22), may include the same size andshape as, or a size and shape substantially similar to, that of thefirst electrode 1406.

FIG. 24 illustrates a plan view of an alternate embodiment of anelectrode 1506 suitable for use in a battery assembly, in accordancewith some described embodiments. As shown, the electrode 1506 mayinclude a “C-shaped configuration.” In this regard, the electrode 1506may include a first part 1520, or first rectangular portion. Theelectrode 1506 may further include a second part 1522, or secondrectangular portion, and a third part 1524, or third rectangularportion, both of which extend perpendicular, or substantiallyperpendicular, with respect to the first part 1520. The dotted linesdenote interface regions between the first part 1520 and the second part1522, as well as between the first part 1520 and the third part 1524. Insome embodiments (not shown), the size of the first part 1520 is thesame as, or substantially similar to, the second part 1522 and the thirdpart 1524. However, in the embodiment shown in FIG. 24, the size of thefirst part 1520 is greater than that of the second part 1522, and alsogreater than that of the third part 1524. Also, as shown in FIG. 24, thesize of the second part 1522 is the same as, or substantially similarto, that of the third part 1524. However, in some embodiments (notshown), the size of the second part 1522 may vary from that of the thirdpart 1524. For example, the size of the second part 1522 may be largeror smaller than the size of the third part 1524.

The electrode 1506 may also be characterized as including a first wall1534 having a first dimension 1544, and a second wall 1536 having asecond dimension 1546. As shown, the first wall 1534 is parallel, or atleast substantially parallel, with respect to the second wall 1536, andthe second dimension 1546 includes a length that is the same, or atleast substantially similar, to that of first dimension 1544. Also, theelectrode 1506 may include a third wall 1538 (separating the first wall1534 from the second wall 1536) having a third dimension 1548, a fourthwall 1540 having a fourth dimension 1550, and a fifth wall 1542 having afifth dimension 1552. As shown, the third wall 1538 is parallel, or atleast substantially parallel, with respect to the fourth wall 1540 andthe fifth wall 1542. Also, each of the fourth dimension 1550 and thefifth dimension 1552 is less than the third dimension 1548. Also, thethird wall 1538 is perpendicular, or at least substantiallyperpendicular, with respect to the first wall 1534 and the second wall1536. As shown in FIG. 24, the first dimension 1544 is the same as thesecond dimension 1546. However, the first dimension 1544 may differ fromthe second dimension 1546, such as being less than or greater than.Further, the electrode 1506 may include a sixth wall 1562 parallel, orat least substantially parallel, with respect to the third wall 1538.The sixth wall 1562 may include a sixth dimension 1572 that is less thanthe third dimension 1548. As shown in FIG. 24, the fourth dimension1550, the fifth dimension 1552, and the sixth dimension 1572 may combineto equal the third dimension 1548. Also, it should be noted that anyadditional electrode(s) and separator(s) included in a battery assembly(not shown) may include the same size and shape as, or a size and shapesubstantially similar to, that of the electrode 1506.

FIG. 25 illustrates a plan view of an alternate embodiment of anelectrode 1606 suitable for use in a battery assembly, in accordancewith some described embodiments. As shown, the electrode 1606 mayinclude an “I-shaped configuration.” In this regard, the electrode 1606may include a first part 1620, or first rectangular portion, a secondpart 1622, or second rectangular portion, and a third part 1624, orthird rectangular portion. The dotted lines denote interface regionsbetween the first part 1620 and the second part 1622, as well as betweenthe first part 1620 and the third part 1624. As shown, both the secondpart 1622 and the third part 1624 extend perpendicular, or substantiallyperpendicular to, the first part 1620. Similar to a shape resembling aletter “I”, the first part 1620 may be centered, or substantiallycentered, with respect to the second part 1622 and the third part 1624.As shown, the size of the first part 1620 is the same as, orsubstantially similar to, the second part 1622 and the third part 1624.However, in some embodiments (not shown), the size of the first part1620 is different than that of the second part 1622, and also differentthan that of the third part 1624. Also, as shown in FIG. 25, the size ofthe second part 1622 is the same as, or substantially similar to, thatof the third part 1624. However, in some embodiments (not shown), thesize of the second part 1622 may vary from that of the third part 1624.For example, the size of the second part 1622 may be larger or smallerthan the size of the third part 1624. Also, in some embodiments, thethird part 1624 is removed from the electrode 1606 such that theelectrode 1606 includes a “T-shaped configuration.”

The electrode 1606 may also be characterized as including a first wall1634 having a first dimension 1644, and a second wall 1636 having asecond dimension 1646. As shown, the first wall 1634 is parallel, or atleast substantially parallel, with respect to the second wall 1636, andthe second dimension 1646 includes a length that is the same as, or atleast substantially similar to, that of first dimension 1644. Also, theelectrode 1606 may include a third wall 1638 that includes a thirddimension 1648. The third wall 1638 may be perpendicular, or at leastsubstantially perpendicular, with respect to the first wall 1634 and thesecond wall 1636, and the third dimension 1648 includes a length that isthe same as, or at least substantially similar to, that of firstdimension 1644 and the second dimension 1646.

The electrode 1606 may be further characterized as having a first part1620 aligned with, and symmetrically disposed about, a firstlongitudinal axis 1652 that extend through the first part 1620. The term“longitudinal” as used throughout this detailed description and in theclaims refers to a direction extending along a major axis of acomponent, with a “major” dimension corresponding to the greatest(longest) dimension of a part or portion of an electrode. The electrode1606 may also include a second part 1622 and a third part 1624 alignedwith, and symmetrically disposed about, a second longitudinal axis 1654and a third longitudinal axis 1656, respectively. The secondlongitudinal axis 1654 may be aligned parallel with respect to the thirdlongitudinal axis 1656. Also, the first longitudinal axis 1652 may beperpendicular with respect to the second longitudinal axis 1654 and thethird longitudinal axis 1656. Also, it should be noted that anyadditional electrode(s) and separator(s) included in a battery assembly(not shown) may include the same size and shape as, or a size and shapesubstantially similar to, that of the electrode 1606.

FIG. 26 illustrates a plan view of an alternate embodiment of anelectrode 1706 suitable for use in a battery assembly, in accordancewith some described embodiments. As shown, the electrode 1706 mayinclude an “L-shaped configuration,” similar to that of the firstelectrode 1406 (shown in FIG. 23). In this regard, the electrode 1706may a first part 1720, or first rectangular portion, and a second part1722, or second rectangular portion, that extends from the first part1720 in a perpendicular manner. The dotted line denotes an interfaceregion between the first part 1720 and the second part 1722. In someembodiments (not shown), the size of the first part 1720 is the same as,or substantially similar to, the second part 1722. However, in theembodiment shown in FIG. 26, the size of the first part 1720 is greaterthan that of the second part 1722. Also, the electrode 1706 may furtherinclude an opening 1730 defining a void or space in the electrode 1706.The opening 1730 may allow for a battery assembly (not shown) thatincludes the electrode 1706, as well as other electrodes having asimilar size and shape as that of the electrode 1706, to position acomponent (not shown) at a location corresponding to the opening 1730.In this manner, the battery assembly may accommodate the component byway of the opening 1730, when the openings of the electrodes andseparators are aligned with one another to form a continuous throughhole through the layers of electrodes and separators of the batteryassembly. This will be further discussed below. Also, while the opening1730 is shown in the electrode 1706, other embodiments, such as theembodiments of an electrode shown in FIGS. 23-25, may include anopening.

The various embodiments of the electrodes shown and described in FIGS.23-26 can be formed by a cutting operation, including die cutting. A diecutting operation may include an electrode sheet undergoing a cuttingoperation using a die of a predetermined size and shape. The die mayinclude a size and shape corresponding to the size and shape of theelectrodes shown in FIGS. 23-26. It should be noted that the separatorscan be die cut in a similar manner. Accordingly, the shape of electrodesdescribed herein may include shapes other a rectilinear shape. In thisregard, a battery assembly may include a size and shape in accordancewith the electrodes and separators so that the battery assembly can takeon various sizes and shape in order to increase the battery assemblysize and or/to accommodate other internal components in an electronicdevice.

FIGS. 27-29 illustrate various embodiments of a battery assemblysuitable for use with electronic devices described herein. Somecomponents of the electronic devices shown in FIGS. 27-29 are removedfor purposes of illustration. The die cutting operation (describedabove) used to form the electrodes for the battery assemblies describedherein may be cut into various sizes and shapes. In this regard, thebattery assemblies may take on different sizes and shapes. Also, theelectronic devices and battery assemblies shown in FIGS. 27-29 mayinclude any component(s) and feature(s) previously described for anelectronic device. Also, while a discrete number of embodiments for abattery assembly are shown, several other configurations are possible.

FIG. 27 illustrates an embodiment of a battery assembly 1860 in anelectronic device 1800, with the battery assembly 1860 having a shapethat accommodates an internal component 1870 of the electronic device1800, in accordance with some described embodiments. As shown, thebattery assembly 1860 may include a C-shape configuration to accommodatethe internal component 1870, which may include a circuit board assembly(previously described). The term “accommodate” may refer to modifyingthe size and shape of a component (such as the battery assembly 1860) inorder to avoid or mitigate modifying the size, shape, and/or position ofanother component (such as the internal component 1870) in theelectronic device 1800. As an example, battery assemblies shown anddescribed herein may accommodate another component(s) by providing spacethat would otherwise be occupied by a traditional, rectilinear battery.Also, any electrode(s) and separator(s) of the battery assembly 1860also include a C-shape configuration having a shape similar to that ofthe electrode 1506 (shown in FIG. 24). Accordingly, the battery assembly1860 may include a housing defined by one or more cover elements thatincludes a C-shaped configuration.

FIG. 28 illustrates an alternate embodiment of a battery assembly 1960in an electronic device 1900, with the battery assembly 1960 having ashape that accommodates multiple internal components of the electronicdevice 1900, in accordance with some described embodiments. As shown,the battery assembly 1960 may include an “I-shape” configuration inorder to accommodate both a first internal component 1970 and a secondinternal component 1972. Each of the first internal component 1970 andthe second internal component 1972 may represent a component such as acircuit board, an audio module, a flexible circuit, or a similarcomponent. FIG. 28 further shows the first internal component 1970 andthe second internal component 1972 positioned in different spacesbetween extensions of the battery assembly 1960. Also, any electrode(s)and separator(s) of the battery assembly 1960 also include an I-shapeconfiguration having a shape similar to that of the electrode 1606(shown in FIG. 25). Accordingly, the battery assembly 1960 may include ahousing defined by one or more cover elements that includes an I-shapedconfiguration.

FIG. 29 illustrates an alternate embodiment of a battery assembly 2060in an electronic device 2000, with the battery assembly 2060 having anopening 2062 that accommodates an internal component 2072 of theelectronic device 2000, in accordance with some described embodiments.As shown, the opening 2062 may include a size and shape such thatinternal component 2072 can be positioned with a perimeter of theopening 2062. While the opening 2062 includes a generally circularopening, the opening 2062 may take the form of other shapes, includingthree- and four-side shapes, as non-limiting examples. Also, as shown inFIG. 29, the battery assembly 2060 may include an L-shaped configuration(although other aforementioned shapes are possible) to accommodate aninternal component 2070 (which may include a circuit board assembly),and may also include the opening 2062. The L-shaped configuration of thebattery assembly 2060 allows for the internal component 2070 to bepositioned at least partially between edges of the battery assembly2060, such as a first edge 2064 and a second edge 2066. Also, a batteryassembly that includes an L-shape configuration as well as an opening(similar to the opening 2062) may include electrodes and separatorsaligned with one another and having a shape similar to that of theelectrode 1706 (shown in FIG. 26). In other words, any electrode(s) andseparator(s) of the battery assembly 2060 also include an L-shapeconfiguration with an opening, similar to that of the electrode 1706(shown in FIG. 26). Accordingly, the battery assembly 2060 may include ahousing defined by one or more cover elements that includes an L-shapedconfiguration as well as an opening.

In addition to having various sizes and shapes (other than a traditionalrectilinear shape), the battery assemblies described herein may includeadditional features. For example, FIG. 30 illustrates an alternateembodiment a battery assembly 2160 in an electronic device 2100, withthe battery assembly 2160 positioned in an enclosure 2102 (of theelectronic device 2100) over a first internal component 2172 (shown as adotted line) of the electronic device 2100, in accordance with somedescribed embodiments. Due in part to additional room provided by thedisplay layer 204 (shown in FIG. 5), the battery assembly 2160 may coveror overlay some components, such as the first internal component 2172.Also, in order to accommodate the circuit board assembly 2170 within theenclosure 2102, the battery assembly 2160 may include an L-shapedconfiguration. In this manner, the battery assembly 2160 provides alocation that accommodates a portion of the circuit board assembly 2170(also including an L-shaped configuration, as shown herein), whereas anotherwise rectilinear battery may not accommodate the circuit boardassembly 2170. As shown in FIG. 30, the circuit board assembly 2170 can“mate” with the battery assembly 2160 similar to puzzle pieces. Also,the battery assembly 2160 may further include a channel 2162 thatdefines a reduced dimension of the battery assembly 2160. In thismanner, the electronic device 2100 may include a flexible circuit 2164that passes over the battery assembly 2160, along the channel 2162, andelectrically couples with the circuit board assembly 2170 as well as asecond internal component 2174, which may include an operationalcomponent (such as an audio module, as a non-limiting example), in orderto place the second internal component 2174 in electrical communicationwith the circuit board assembly 2170. While the flexible circuit 2164 isdescribed as being electrically coupled to the second internal component2174, the flexible circuit 2164 may also electrically couple with athird internal component (not shown), such as an antenna. In eitherevent, the channel 2162 formed in the battery assembly 2160 allows forthe rearrangement of various internal components. Also, the batteryassembly 2160 may include an increased size, corresponding to anincreased electrical storage capacity, as the battery assembly 2160 canbe positioned over the first internal component 2172.

FIG. 31 illustrates a cross sectional view of the electronic device 2100shown in FIG. 30, taken along line C-C in FIG. 30. Due in part to thedie cutting operation (described above) for electrodes and separators,the battery assembly 2160 may pass over the first internal component2172. Moreover, as shown in FIG. 31, a portion of the battery assembly2160 may lie flat on the enclosure 2102, while another portion of thebattery assembly 2160 covers the first internal component 2172. In otherwords, the battery assembly 2160 can elevate over the first internalcomponent 2172, and also at least partially conform to the size andshape of the first internal component 2172. Further, the electrodes mayalso pass over the first internal component 2172. For example, thebattery assembly 2160 includes a first electrode 2182 and a secondelectrode 2184, with a separator 2186 positioned between the firstelectrode 2182 and the second electrode 2184. As shown in FIG. 31, thefirst electrode 2182, the second electrode 2184, and the separator 2186may pass over the first internal component 2172. Further, the diecutting operation can form the first electrode 2182 and the secondelectrode 2184 such that the electrodes terminate prior to entering alocation in the battery assembly 2160 corresponding to the channel 2162,thereby allowing the channel 2162 to reduce the dimensions of thebattery assembly 2160 to receive the flexible circuit 2164. Although notshown, the channel 2162 may include a size and shape to receive two ormore flexible circuits in order to electrically couple additionalinternal components (not shown) with the circuit board assembly 2170(shown in FIG. 30). Accordingly, the flexible circuit 2164 (oradditional flexible circuits) need not be positioned around a perimeterof the battery assembly 2160.

FIG. 32 illustrates an exploded view of the circuit board assembly 170shown in FIG. 4, in accordance with some described embodiments. Asshown, the circuit board assembly 170 may include a first circuit board172 and a second circuit board 174. In some embodiments, each of thefirst circuit board 172 and the second circuit board 174 includes aprinted circuit board. Also, the first circuit board 172 may be securedwith, and positioned over, the second circuit board 174 in a stackedconfiguration. As shown in FIG. 32, the first circuit board 172 includesa size and shape that is the same as, or at least substantially similarto, the size and shape of the second circuit board 174. However, in someembodiments (not shown), the first circuit board 172 includes at leastsome differences, as compared to the second circuit board 174, withregard to size and/or shape. While the stacked configuration of thecircuit board assembly 170 increases the footprint of the circuit boardassembly 170 in the electronic device 100 (shown in FIG. 1) in thez-dimension, the stacked configuration decreases the footprint of thecircuit board assembly 170 in both the x- and y-dimensions. Theadditional space provided by stacking the aforementioned circuit boardsmay provide additional space in the electronic device 100 for othercomponents, such as the battery assembly 160 (shown in FIG. 4). Also,the additional space provided by reduced dimensions of the displayassembly 102 (shown in FIG. 5) provides room for the circuit boardassembly 170. In other words, additional space in the z-dimension, duein part to the reduced dimensions of the display assembly 102, allow forthe stacked configuration of the circuit board assembly 170. Althoughnot shown, the circuit board assembly 170 may include three or morecircuit boards in a stacked configuration and in electricalcommunication with each other.

The first circuit board 172 and/or the second circuit board 174 mayinclude several operational components. An “operational component” mayrefer to a component, such as an integrated circuit or processor circuitthat performs an operation (or operations) such as executinginstructions from a software application that is stored on a memorycircuit. An operational component may also refer to a transistor.Operational components on either of the first circuit board 172 and/orthe second circuit board 174 may convert electrical energy to thermalenergy during operation. However, a thermal distribution assembly (notshown) is designed to remove the thermal energy from the circuit boardassembly 170. This will be discussed below. As shown in FIG. 32, thecircuit boards may include operational components on multiple surfaces.For example, the first circuit board 172 may include a first mountingsurface 2202 and a second mounting surface 2204 opposite the firstmounting surface 2202, with the first mounting surface 2202 having afirst operational component 2212 and the second mounting surface 2204having a second operational component 2214 (shown as a dotted line). Asshown in FIG. 32, both the first mounting surface 2202 and the secondmounting surface 2204 may include additional operational components.Also, it should be noted that the operational components on the firstcircuit board 172 are in electrical communication with each other. Thecommunication means may include, for example, at least one via (notshown) that extends through the first circuit board 172.

The second circuit board 174 may include a first mounting surface 2206that includes several operational components, such as an operationalcomponent 2216. The second circuit board 174 also includes a secondmounting surface 2208 opposite the first mounting surface 2206. In someembodiments, the second mounting surface 2208 includes an operationalcomponent (or components) in electrical communication with theoperational components located on the first mounting surface 2206. Also,it should be noted that when the circuit board assembly 170 isassembled, the second circuit board 174 is overlaid (or covered) by thefirst circuit board 172 in the stacked configuration. However, it shouldbe noted that the first circuit board 172 is still separated from thesecond circuit board 174 by at least some gap or space. Also, when thecircuit board assembly 170 is assembled, the first mounting surface 2206of the second circuit board 174 is facing the second mounting surface2204 of the first circuit board 172, and vice versa.

The first circuit board 172 may mechanically connect with the secondcircuit board 174 by several standoffs connected with rivets. Forexample, as shown in FIG. 32, the second circuit board 174 includes afirst standoff 2222 designed to connect with a first rivet 2224 locatedon the first circuit board 172. Each of the remaining standoffs (notlabeled) shown in FIG. 19 may connect with a rivet (not labeled) shownin FIG. 32. The standoffs are designed to not only provide mechanicalconnections, but also to maintain a desired distance between the firstcircuit board 172 and the second circuit board 174 such that componentson the second mounting surface 2204 of the first circuit board 172 donot interfere (physically) with components on the first mounting surface2206 of the second circuit board 174, and vice versa. Also, thepositioning of the standoffs and the rivets may be reversed such thatthe first circuit board 172 includes the standoffs and the secondcircuit board 174 includes the rivets.

In order to electrically couple the first circuit board 172 with thesecond circuit board 174, several interposers may be used to routeelectrical signals between the first circuit board 172 and the secondcircuit board 174. For example, as shown in FIG. 32, the second circuitboard 174 may include several interposers, such as an interposer 2232,electrically with the second circuit board 174 by, for example, asoldering operation. Several additional interposers (not labeled) areshown. Also, although not shown, the second circuit board 174 mayinclude several metal traces that electrically couple the interposerswith one or more operational components on the second circuit board 174.Also, when the first circuit board 172 is electrically coupled to thesecond circuit board 174, each of the interposers may electricallycouple with one or more metal traces (not shown) on the second mountingsurface 2204 of the first circuit board 172.

The circuit board assembly 170 may include several shielding elementsthat shield the components of the circuit board assembly 170 fromelectromagnetic interference (“EMI”). For example, the circuit boardassembly 170 may include a first shielding element 2242 that coverscomponents located on the first mounting surface 2202 of the firstcircuit board 172. The first shielding element 2242 may include ametal-based material designed to provide an EMI shield to the componentson the first mounting surface 2202. The circuit board assembly 170 mayfurther include a second shielding element 2244 designed to provide anEMI shield for components located on the second mounting surface 2204 ofthe first circuit board 172 and the first mounting surface 2206 of thesecond circuit board 174. The second shielding element 2244 may includea metal, such as copper or brass. The second shielding element 2244 maysecure with (and between) the first circuit board 172 and the secondcircuit board 174 by several solder joints disposed on each circuitboard. For example, FIG. 32 shows the second circuit board 174 having afirst solder joint 2250 positioned around an outer perimeter of thesecond circuit board 174. Several additional solder joints in additionto the first solder joint 2250 are shown but not labeled. The firstcircuit board 172 may also include solder joints (not shown) inlocations corresponding to the solder joints on the second circuit board174. In some embodiments, the second shielding element 2244 includesseveral discontinuous structural elements. In the embodiment shown inFIG. 32, the second shielding element 2244 may include a single,continuous structural component designed to extend along an outerperimeter of the circuit board assembly 170. Alternatively, the secondshielding element 2244 may include several shielding element parts thatcombine with one another to form the second shielding element 2244.

The circuit board assembly 170 may further include a third shieldingelement 2246 positioned on the second mounting surface 2208 of thesecond circuit board 174. The third shielding element 2246 is designedto combine with the first shielding element 2242 and the secondshielding element 2244 to provide an EMI shield to the circuit boardassembly 170. Also, the second mounting surface 2208 of the secondcircuit board 174 may include metal traces (throughout the secondmounting surface 2208). In this regard, in addition to forming an EMIshield, the third shielding element 2246 may define at least part of anelectrical ground path for the circuit board assembly 170, as the thirdshielding element 2246 is electrically connect to the second mountingsurface 2208 by way of the metal traces. Also, when the component (orcomponents) of the circuit board assembly 170 generates EMI duringoperation, the aforementioned shielding elements may shield componentsof the electronic device 100 (shown in FIG. 1) that are external withrespect to the circuit board assembly 170 from EMI generated by thecomponent(s) of the circuit board assembly 170.

FIG. 33 illustrates a cross sectional view of the circuit board assembly170 shown in FIG. 32, showing various internal components of the circuitboard assembly 170. As shown, the first circuit board 172 may beseparated from the second circuit board 174 by a standoff 2226. Further,in order to mechanically couple the first circuit board 172 with thesecond circuit board 174, the standoff 2226 can be mechanically coupledwith the a rivet 2228, with the standoff 2226 and the rivet 2228electrically isolated from the components of the first circuit board 172and the second circuit board 174.

The first circuit board 172 may include a via 2218 formed from a metalto provide an electrical connection between the first operationalcomponent 2212 and the second operational component 2214. Also, thefirst circuit board by 172 may be in electrical communication with thesecond circuit board 174 by way of an interposer 2234. As shown, theinterposer 2234 may electrically and mechanically connect with a firstsolder joint 2262 located on the first circuit board 172, and may alsoelectrically and mechanically connect with a second solder joint 2264located on the second circuit board 174. In addition to the interposer2234, several additional interposers (not shown) may be used to carrysignals between the circuit boards. The first circuit board 172 mayinclude a first metal trace 2272 electrically connected with the secondoperational component 2214 as well as the via 2218, and the secondcircuit board 174 may include a second metal trace 2274 electricallyconnected with a third operational component 2220 located on the secondcircuit board 174. In this manner, the third operational component 2220may electrically communicate with the second operational component 2214by way of the interposer 2234 and the metal traces. The thirdoperational component 2220 may electrically communicate with the firstoperational component 2212 by way of the via 2218, the interposer 2234,and the metal traces. The circuit board assembly 170 may use severaladditional metal traces, vias, and solder joints to provide additionalelectrical communication pathways.

FIG. 34 illustrates an alternative embodiment of a circuit boardassembly 2370, showing the circuit board assembly 2370 modified foringress protection. The circuit board assembly 2370 may include anycomponents and features previously described for a circuit boardassembly, such as a first circuit board 2372 and a second circuit board2374. However, as shown in FIG. 34, the circuit board assembly 2370 mayinclude a potting material 2390 embedded in the circuit board assembly2370 between the first circuit board 2372 and a second circuit board2374. The potting material 2390 may include resin that cures to form aliquid-resistant shield for the various operational components of thecircuit board assembly 2370, such as an operational component 2314. Inthis regard, the potting material 2390 may prevent damage caused byliquid ingress to the circuit board assembly 2370, and in particular, tothe components of the circuit board assembly 2370. Further, the pottingmaterial 2390 may extend to a first shielding element 2342 and a secondshielding element 2344 of the circuit board assembly 2370, in order toprevent corrosion to components, such as a standoff 2326. The pottingmaterial 2390 may be used with the circuit assemblies described herein.

FIG. 35 illustrates an alternate embodiment of a circuit board assembly2470, showing the circuit board assembly 2470 having a flexible circuit2402 electrically coupled with the circuit boards of the circuit boardassembly, in accordance with some described embodiments. The circuitboard assembly 2470 may include any components and/or featurespreviously described for a circuit board assembly. For example, asshown, the circuit board assembly 2470 may include a first circuit board2472 and a second circuit board 2474. The circuit board assembly 2470may further include a first shielding element 2442 disposed over thefirst circuit board 2472 and at least some of its components. Thecircuit board assembly 2470 may further include a second shieldingelement 2444 covering a gap between the first circuit board 2472 and thesecond circuit board 2474. The circuit board assembly 2470 may furtherinclude a third shielding element 2446 disposed over the second circuitboard 2474. However, rather than using interposers for electricalcommunication between the first circuit board 2472 and the secondcircuit board 2474 (and their respective components), the circuit boardassembly 2470 in FIG. 35 uses the flexible circuit 2402 forcommunication of electrical signals between the operational componentslocated on the first circuit board 2472 and/or the second circuit board2474.

The flexible circuit 2402 may electrically and mechanically couple withthe first circuit board 2472, and form a loop to electrically andmechanically couple with the second circuit board 2474. The electricaland mechanical coupling may be performed using a hot bar solderingoperation. A thermode (not shown) may be used as a “hot bar” that isheated in order to supply thermal energy to the flexible circuit 2402and to soldering elements (not shown) on the first circuit board 2472and the second circuit board 2474, resulting in an electro-mechanicalconnection of the flexible circuit 2402 to the first circuit board 2472and the second circuit board 2474. It should be noted that multiple hotbar soldering operations may be used to couple the flexible circuit 2402with the first circuit board 2472 and the second circuit board 2474.

FIG. 36 illustrates a cross sectional view of the circuit board assembly2470 shown in FIG. 35, taken along line D-D, showing the flexiblecircuit 2402 extending between the circuit boards. As shown, theflexible circuit 2402 is electro-mechanically coupled with a firstsolder joint 2412 and a second solder joint 2414, located on the firstcircuit board 2472 and the second circuit board 2474, respectively.Also, the first solder joint 2412 may electrically couple with a firstmetal trace 2422 on the first circuit board 2472, and the second solderjoint 2414 may electrically couple with a second metal trace 2424 on thesecond circuit board 2474. As a result, the flexible circuit 2402 mayelectrically couple with several operational components (not shown),some of which are electrically coupled with the first metal trace 2422and located on the first circuit board 2472, and some of which areelectrically coupled with the second metal trace 2424 and located on thesecond circuit board 2474.

FIG. 37 illustrates a cross sectional view of an alternate embodiment ofa circuit board assembly 2570, showing internal components of thecircuit board assembly 2570 having corresponding geometries, inaccordance with some described embodiments. The circuit board assembly2570 may include any components and/or features previously described fora circuit board assembly. For example, the circuit board assembly 2570may include a first circuit board 2572 and a second circuit board 2574,with the first circuit board 2572 in electrical communication with thesecond circuit board 2574 by way of an interposer 2520. Additionalinterposers (not shown) may electrically couple the first circuit board2572 (and components thereon) with the second circuit board 2574 (andcomponents thereon). The first circuit board 2572 may include a firstmounting surface 2502 having a first operational component 2512 and asecond mounting surface 2504 (opposite the first mounting surface 2502)that includes a second operational component 2514 electrically coupledto a metal trace (not labeled). Further, the second circuit board 2574may include a third operational component 2516 electrically coupled to ametal trace (not labeled), with the third operational component 2516 andthe metal trace located on a first mounting surface 2506 of the secondcircuit board 2574.

As shown in FIG. 37, the second operational component 2514 and the thirdoperational component 2516 may be in a nested configuration. Forexample, the third operational component 2516 may include a protrusion2518 that at least partially extend into a recess 2522 of the secondoperational component 2514. The corresponding geometry between thesecond operational component 2514 and the third operational component2516 may allow for a reduced dimension (or reduced height) of thecircuit board assembly 2570, thereby reducing the overall space occupiedby the circuit board assembly 2570 in an electronic device (not shown).In other words, the separation or gap between the first circuit board2572 and the second circuit board 2574 may decrease, as compared toprior embodiments, due to the corresponding, or nested, configurationsof the components of the first circuit board 2572 and the second circuitboard 2574 in a manner similar to that of the second operationalcomponent 2514 and the third operational component 2516.

Also, in some instances, components on different circuit boards mayelectrically and mechanically couple with one another by direct means.For example, FIG. 37 further shows the first circuit board 2572 having afourth operational component 2534 located on the second mounting surface2504, and a fifth operational component 2536 located on the firstmounting surface 2506 of the second circuit board 2574. The fourthoperational component 2534 may include a recess 2542 and a connector2544 positioned in the recess 2542. Further, the fifth operationalcomponent 2536 may include a protrusion 2538 that extends into therecess 2542, and electrically and mechanically couples with theconnector 2554. In this manner, the fourth operational component 2534 iselectrically and mechanically coupled with the fifth operationalcomponent 2536.

Moreover, when the circuit board assembly 2570 includes operationalcomponents, such as the fourth operational component 2534 and the fifthoperational component 2536, the first circuit board 2572 may beelectrically coupled to the second circuit board 2574 by way of thefourth operational component 2534 and the fifth operational component2536. As a result, the circuit board assembly 2570 may not requireinterposers (such as the interposer 2520) to provide electricalcommunication between the first circuit board 2572 and the secondcircuit board 2574. Further, as shown in FIG. 37, the first circuitboard 2572 may include a via 2546 electrically coupled with fourthoperational component 2534 as well as a metal trace (not labeled). Inthis manner, the first operational component 2512 may electricallyconnect to the fifth operational component 2536 by way of the metaltrace, the via 2546, and the fourth operational component 2534. Itshould be noted that in some embodiments, the circuit board assembly2570 includes either a combination of the second operational component2514 and the third operational component 2516, as well as the fourthoperational component 2534 and the fifth operational component 2536.

FIG. 38 illustrates a cross sectional view of an alternate embodiment ofa circuit board assembly 2670, showing the circuit board assembly 2670having several solder masks used to support a circuit board, anaccordance with some described embodiments. The circuit board assembly2670 may include any components and/or features previously described fora circuit board assembly. For example, the circuit board assembly 2670may include a first circuit board 2672 and a second circuit board 2674.Further, each the first circuit board 2672 and the second circuit board2674 may include several solder joints (not labeled), with an interposerelectrically coupled with a solder joint from the first circuit board2672 and with a solder joint from the second circuit board 2674. Forexample, FIG. 38 shows the circuit board assembly 2670 having a firstinterposer 2602 electrically and mechanically coupled with a solderjoint (not labeled) on the first circuit board 2672 and the secondcircuit board 2674, a second interposer 2604 electrically andmechanically coupled with a solder joint (not labeled) on the firstcircuit board 2672 and the second circuit board 2674, and a thirdinterposer 2606 electrically and mechanically coupled with a solderjoint (not labeled) on the first circuit board 2672 and the secondcircuit board 2674.

In order to prevent oxidation of the solder joints and/or to preventsolder “bridges” from forming between adjacent solder joints during asoldering operation, the circuit board assembly 2670 may include severalsoldering masks. For example, the circuit board assembly 2670 mayinclude a first solder mask 2622 between the first interposer 2602 andthe second interposer 2604, and a second solder mask 2624 between thesecond interposer 2604 and the third interposer 2606. Based on theirpositions, the first solder mask 2622 may prevent a solder bridge fromforming between the first interposer 2602 and the second interposer 2604(thereby preventing unwanted electrical coupling between the firstinterposer 2602 and the second interposer 2604), and the second soldermask 2624 may prevent a solder bridge from forming between the secondinterposer 2604 and the third interposer 2606 (thereby preventingunwanted electrical coupling between the second interposer 2604 and thethird interposer 2606). Moreover, the first solder mask 2622 and thesecond solder mask 2624 may provide a support structure that maintains adesired distance or separation between the first circuit board 2672 andthe second circuit board 2674. Further, in order to maintain the firstcircuit board 2672 with the second circuit board 2674, both the firstcircuit board 2672 and the second circuit board 2674 may clamp onto endsof the first solder mask 2622 and the second solder mask 2624. Theinterposers, solder joints, and solder masks may be representative ofseveral additional interposers, solder joints, and solder masks,respectively.

FIG. 39 illustrates an isometric view of an embodiment of an audiomodule 2700, in accordance with some described embodiments. The audiomodule 2700 may be used in place of the first audio module 182 (shown inFIG. 4). The audio module 2700 may be used as a receiver module designedto generate acoustical energy in the form of audible sound. Generally, areceiver module is used in low power applications associated withrelatively low frequency output. However, the audio module 2700 mayinclude modifications for enhanced audio performance associated with anaudio speaker module.

The audio module 2700 may include an audio module housing 2702 having anaudio module opening 2704. The audio module housing 2702 may define aninternal acoustical volume partitioned into a front volume and a backvolume. This will be shown below. The audio module housing 2702 maycarry a diaphragm 2706, or membrane, designed to vibrate, therebygenerating acoustical energy in the form of audible sound. Accordingly,the diaphragm 2706 may be referred to as a membrane, or acousticalmembrane. The diaphragm 2706 may include additional thickness to handleadditional vibrational energy (associated with additional power suppliedto the audio module 2700), and accordingly, additional audiofrequencies. Also, the audio module opening 2704 may represent a single,unaltered opening in the audio module housing 2702, and any otheropenings in the audio module housing 2702 (used for wiring andelectrical communication, as an example) may be air-sealed andliquid-sealed. In this regard, the diaphragm 2706 may be prevented fromunwanted vibration due to air entering the audio module housing 2702during a change in air pressure inside an electronic device (not shown).This will be further illustrated below. Also, in some embodiments, thediaphragm 2706 includes a liquid-resistant diaphragm (orliquid-resistant membrane) designed to withstand damage due to expose toliquids, such as water.

FIG. 40 illustrates a cross sectional view of the audio module 2700shown in FIG. 39, taken along line D-D in FIG. 39, showing severalinternal features of the audio module 2700. As shown, the audio module2700 includes a sound coil 2708 and a magnet 2710. The sound coil 2708is designed to receive an alternating electrical current to form anelectromagnet with an alternating magnetic polarity. The alternatingmagnetic polarity may cause the sound coil to vibrate based oninteraction (attraction and repulsion) with an external magnetic fieldof the magnet 2710.

The diaphragm 2706 is positioned in the audio module housing 2702 andseparates an acoustical volume (defined in part by the audio modulehousing 2702) into a front volume 2720 and a back volume 2722. As shown,the front volume 2720 may open to the audio module opening 2704, whilethe back volume 2722 is sealed from the audio module opening 2704.Further, when the audio module 2700 is positioned in the electronicdevice 100 (shown in FIG. 1), the audio module housing 2702 can sealcomponents of the audio module 2700 from air in the electronic device100 so that, for example, the diaphragm 2706 is not acoustically driven,or otherwise influenced, by air pressure changes in the electronicdevice 100. As shown, the front volume 2720 and the back volume 2722 maybe shielded from air pressure changes in the electronic device 100.However, when the diaphragm 2706 vibrates to create acoustical energy,the acoustical energy exits the audio module opening 2704. Also, in someembodiments, the audio module 2700 includes an air vent 2730 that allowsair into the back volume 2722 (by way of air entering the audio moduleopening 2704), and out of the back volume 2722 to the audio moduleopening 2704 such that the back volume 2722 can equilibrate with ambientair when the air pressure of the external ambient air changes. Also,while the audio module 2700 may substitute for the first audio module182 (shown in FIG. 4), the audio module 2700 may include differentdesigns and shapes such that the audio module 2700 may also substitutefor the second audio module 184 (shown in FIG. 4).

FIG. 41 illustrates a cross sectional view of the electronic device 100,showing the audio module 2700 positioned in the electronic device 100.As shown, the audio module 2700, and in particular, the audio moduleopening 2704, is aligned with at least the one of the openings 134 (bothof which are shown in FIG. 1). Also, a mesh material 2724 may cover theopenings 134 and provide an aesthetic finish. Also, in some embodiments,the audio module 2700 is fitted with a bracket 2726. The bracket 2726may secure with the audio module 2700 by an adhesive 2728, which mayinclude a liquid-resistant adhesive to prevent liquid from entering theelectronic device 100 around the bracket 2726. Also, the bracket 2726may include a sealing element 2732 positioned between the audio module2700 and the bracket 2726 to form an ingress barrier between the audiomodule 2700 and the bracket 2726. In this manner, the audio module 2700is positioned in the electronic device 100 such that any liquid enteringthe openings 134 may extend into the front volume 2720 but not into theback volume 2722. Also, any air entering the openings 134 may extendinto both the front volume 2720 and the back volume 2722, with thelatter using the air vent 2730 to receive air. The air vent 2730 mayallow air to exit the back volume 2722 as well. Accordingly, the audiomodule 2700 may provide acoustical energy while preventing liquidingress into the electronic device 100. Also, any acoustical energygenerated by the diaphragm 2706 can exit the audio module 2700 via theaudio module opening 2704, and can also exit the electronic device 100via the openings 134.

Further, as shown in FIG. 41, the audio module 2700 can be positioned inthe electronic device 100 such that the audio module opening 2704 isexposed only ambient air (external to the electronic device 100) thatenters the electronic device 100 through the openings 134. In otherwords, the audio module housing 2702 is sealed in a manner such that aninternal volume change that causes an air pressure change in theelectronic device 100 by, for example, depressing the first protectivelayer 104 and the display assembly 102, will not cause air to enter theaudio module housing 2702, thereby preventing the diaphragm 2706 fromgenerating unwanted acoustical noise.

FIG. 42 illustrates an exploded view of the thermal distributionassembly 190, in accordance with some described embodiments. The thermaldistribution assembly 190 may include several layers of material thatprovide not only enhanced heat transfer properties, but also structuralsupport. The enhanced heat transfer properties and structural supportmay be useful when the thermal distribution assembly 190 is used in anelectronic device having a substantially non-metal exterior and thusreduced heat transferred capabilities, such as the electronic device 100having a second protective layer 144 (shown in FIG. 2). In this regard,the thermal distribution assembly 190 can be used in an electronicdevice to direct thermal energy away from a non-metal bottom wall towardanother structural feature of the electronic device, such as theaforementioned sidewall components.

As shown, the thermal distribution assembly 190 may include severallayers of material. For example, the thermal distribution assembly 190may include a first layer 2802 formed from a first type material, whichmay include a durable material, such as stainless steel. The first layer2802 may include a bottom wall 2812, along with a first sidewall 2822and a second sidewall 2824, both of which extend from the bottom wall2812 in a perpendicular, or at least substantially perpendicular,manner. When assembled in the electronic device 100 (shown in FIGS. 1and 2), the thermal distribution assembly 190, and in particular thefirst layer 2802, is thermally coupled to one or more heat-generatingcomponents in the electronic device 100. At least one of the bottom wall2812, the first sidewall 2822, and the second sidewall 2824 may includea contact surface that is in direct thermal contact, or at leastthermally coupled, with a heat-generating component in an electronicdevice. This will be shown below.

The thermal distribution assembly 190 may further include a second layer2804 designed to engage and thermally couple to the first layer 2802.The second layer 2804 may include a bottom wall 2814, along with a firstsidewall 2832 and a second sidewall 2834, both of which extend from thebottom wall 2814 in a perpendicular, or at least substantiallyperpendicular, manner. When the thermal distribution assembly 190 isassembled, the bottom wall 2814, the first sidewall 2832, and the secondsidewall 2834 of the second layer 2804 may engage the bottom wall 2812,the first sidewall 2822, and the second sidewall 2824 of the first layer2802, respectively. Also, the second layer 2804 may be formed from asecond type material, which may include a material having a relativelyhigh thermal conductivity (as compared to the first type material of thefirst layer 2802), such as copper or graphite. In this regard, thesecond layer 2804 is designed to redistribute, redirect, or otherwisespread thermal energy away from a heat-generating component (not shown)in an electronic device when the heat-generating component is thermallycoupled with the thermal distribution assembly 190. The second layer2804 may receive thermal energy from the first layer 2802, when thefirst layer 2802 receives thermal energy from the heat-generatingcomponent(s). At least one of the bottom wall 2816, the first sidewall2842, and the second sidewall 2844 may include a contact surface that isin direct thermal contact, or at least thermally coupled, with thesecond layer 2804.

Also, the thermal distribution assembly 190 may include a third layer2806 designed to combine with the first layer 2802 and enhance thestructural support and rigidity to the thermal distribution assembly190. Accordingly, the third layer 2806 may be formed from a third typematerial, which in some instances is the same or similar to that of thefirst type material for the first layer 2802. The third layer 2806 mayinclude a bottom wall 2816, along with a first sidewall 2842 and asecond sidewall 2844, both of which extend from the bottom wall 2816 ina perpendicular, or at least substantially perpendicular, manner. Whenthe thermal distribution assembly 190 is assembled, the bottom wall2816, the first sidewall 2842, and the second sidewall 2844 of the thirdlayer 2806 may engage the bottom wall 2814, the first sidewall 2832, andthe second sidewall 2834 of the second layer 2804, respectively. Also,when the thermal distribution assembly 190 is positioned in theelectronic device 100 (shown in FIGS. 1 and 2), the first sidewall 2842and the second sidewall 2844 third layer 2806 may engage and thermallycouple to the third sidewall component 116 and the fourth sidewallcomponent 118 (shown in FIG. 1), respectively. In this manner, thethermal distribution assembly 190 can be thermally coupled to portionsof the band 110 (shown in FIGS. 1 and 2). At least one of the bottomwall 2814, the first sidewall 2832, and the second sidewall 2834 mayinclude a contact surface that is in direct thermal contact, or at leastthermally coupled, with the first layer 2802.

Based on the aforementioned material makeup of the thermal distributionassembly 190, the second layer 2804 may include a heat transfercharacteristic that is different from that of the first layer 2802 andthe third layer 2806. For example, the second layer 2804 may be formedfrom a material having a relatively high thermal conductivity, ascompared to the material(s) that forms the first layer 2802 and thethird layer 2806. Also, the first layer 2802 and the third layer 2806may be formed a material having a relatively high durability orrigidity, as compared to the material that forms the second layer 2804.

In order to assemble the thermal distribution assembly 190 with layersof different material makeups, the various layers may undergo a claddingoperation designed to bond the layers together. The cladding operationcan include placing each layer of material on separate rollers, and thenpressing the layers together when the layers pass the rollers. Thepressing effect may create molecular bonds between molecules of themetals. It should be noted that the cladding operation can be used whenthe second layer 2804 includes copper. A different assembly operationmay be used when the second layer 2804 includes graphite. This will beshown and discussed below. Also, when the thermal distribution assembly190 is assembled, the first layer 2802 and the third layer 2806 mayprovide support for the second layer 2804, and may also provide somestructural support to an electronic device (not shown) that carries thethermal distribution assembly 190. While the second layer 2804 isprimarily used for heat transfer, the first layer 2802 and the thirdlayer 2806 may also provide at least some heat transfer capabilities.Also, while the first layer 2802 and the third layer 2806 are primarilyused for structural support, the second layer 2804 may also provide atleast some structural support.

FIG. 43 illustrates a partial cross sectional view of the electronicdevice 100 shown in FIG. 1, showing the thermal distribution assembly190 positioned in the electronic device 100. For purposes ofillustration, some components of the electronic device 100 are removed.As shown, the thermal distribution assembly 190 may be in direct thermalcontact, or at least thermally coupled, with the circuit board assembly170 such that heat generated from one or more operational components ofthe circuit board assembly 170 may pass from the circuit board assembly170 to at least some layers of the thermal distribution assembly 190.For example, as shown in the first enlarged view 2850, thermal energyflow (represented by dotted lines with an arrow), or heat flow,generated from operational components of the circuit board assembly 170may pass through the first layer 2802 to the second layer 2804. Asshown, a contact surface (bottom wall 2812, labeled in FIG. 42) of thefirst layer 2802 is in thermal contact with the circuit board assembly170. Further, due in part to the relatively high thermal conductivity ofthe second layer 2804 (as compared to the third layer 2806), the flow ofthermal energy has a tendency to extend through the first layer 2802 andperpendicular, or at least partially perpendicular, to the first layer2802 and continue through the second layer 2804 rather than through thethird layer 2806. As further shown, the thermal energy flow movesparallel, or at least partially parallel, with respect to a contactsurface (bottom wall 2814, labeled in FIG. 24) of the second layer 2804.Accordingly, the relatively low thermal conductivity of the third layer2806 may prevent thermal energy build-up at a location(s) near thesecond protective layer 144. This will be further discussed below.

Also, as shown in FIG. 43, the thermal distribution assembly 190 can bedesigned to engage the band 110. For example, as shown in the secondenlarged view 2852, a contact surface of the first sidewall 2842 of thethird layer 2806 of the thermal distribution assembly 190 may engage thethird sidewall component 116 of the band 110. Accordingly, the thirdlayer 2806 may be in direct thermal contact, or at least thermallycoupled, with the third sidewall component 116. The second layer 2804may distribute or redirect the thermal energy to the third layer 2806,and in particular from the first sidewall 2832 of the second layer 2804to the first sidewall 2842 of the third layer 2806, so that the thermalenergy is distributed to the third sidewall component 116, where thethermal energy may then dissipate from the third sidewall component 116to the ambient air. The thermal distribution assembly 190 may furtherengage the fourth sidewall component 118 of the band 110, and in thismanner, the thermal distribution assembly 190 can distribute heat to thefourth sidewall component 118 in a manner similar to that of the thirdsidewall component 116 (that is, by way of the sidewalls of the secondlayer 2804 and the third layer 2806, shown in FIG. 42). In this manner,at least one of the sidewall components as a distributed heat sink thatprevents heat generated by the circuit board assembly 170 from becomingtrapped at or near the second protective layer 144 so has to preventformation of a thermal hot spot.

Furthermore, the thermal distribution assembly 190 may prevent or limitthe second protective layer 144 from receiving thermal energy generatedfrom operational components of the circuit board assembly 170, as thethird layer 2806 provides minimal thermal conductivity, as compared tothe second layer 2804, such that the thermal energy in the electronicdevice 100 is primarily carried by the second layer 2804. In thisregard, the second layer 2804 may define a thermal path, or primarythermal path, for thermal energy generated by operational components ofthe circuit board assembly 170. While FIG. 43 shows the thermaldistribution assembly 190 receiving heat from a component(s) of thecircuit board assembly 170, it should be noted that the thermaldistribution assembly 190 can receive heat from any heat-generatingcomponent of the electronic device 100 that is thermally coupled to thethermal distribution assembly 190. Also, the thermal distributionassembly 190 may provide a rigid support structure that supports thesecond protective layer 144. For example, the first layer 2802 and thethird layer 2806 of the thermal distribution assembly 190 may extendacross a major surface of the second protective layer 144, as shown inFIG. 43.

FIG. 44 illustrates a side view of an alternative embodiment of athermal distribution assembly 2900, in accordance with some describedembodiments. The thermal distribution assembly 2900 may include anymaterial(s) and/or feature(s) previously described for a thermaldistribution assembly. The thermal distribution assembly 2900 mayinclude a first layer 2902, a second layer 2904 (shown as a dottedline), and a third layer 2906, with the second layer 2904 embeddedbetween the first layer 2902 and the third layer 2906. As shown, thesecond layer 2904 may be completely covered by the first layer 2902 andthe third layer 2906. This may prevent movement or shifting of thesecond layer 2904 relative to the first layer 2902 and/or the thirdlayer 2906. However, it should be noted that the second layer 2904 maystill receive heat passing through the first layer 2902 and/or the thirdlayer 2906.

FIG. 45 illustrates an isometric view of an alternative embodiment of athermal distribution assembly 3000, showing the thermal distributionassembly 3000 modified to receive a component 3010, in accordance withsome described embodiments. The thermal distribution assembly 3000 mayinclude any material(s) and/or feature(s) previously described for athermal distribution assembly. As shown, the thermal distributionassembly 3000 may include a first layer 3002, a second layer 3004, and athird layer 3006, with the second layer 3004 embedded between the firstlayer 3002 and the third layer 3006.

However, the second layer 3004 may be modified to reduce the dimensionsof the thermal distribution assembly 3000. For example, a portion of thesecond layer 3004 may be locally removed in a desired location such thata portion of the thermal distribution assembly 3000 includes only thefirst layer 3002 and the third layer 3006, thereby reducing (locally)the dimensions of the thermal distribution assembly 3000 where thesecond layer 3004 is not present. As a result of the reduced dimensions,the thermal distribution assembly 3000 may include a first channel 3012that receives the component 3010. The thermal distribution assembly 3000may further include a second channel 3014 that may receive a secondcomponent (not shown). It should be noted that the locations of thefirst channel 3012 and the second channel 3014 correspond to a locationin which the second layer 3004 is not present. However, any component(s)secured with the thermal distribution assembly 3000 at the first channel3012 and/or the second channel 3014 may be thermally coupled to thesecond layer 3004 such that thermal energy generated by the component(s)may be drawn from the component(s) to the second layer 3004.

The component 3010 can be secured with the thermal distribution assembly3000 by welding, soldering, or adhering (by adhesives), as non-limitingexamples. Also, the dimensions of the first channel 3012 allow thecomponent 3010 to be seated in the thermal distribution assembly 3000such that the component 3010 is at least co-planar, and in some casessub-flush, with respect to the first layer 3002. It should be noted thatthe dimensions of the second channel 3014 may allow a second component(not shown) to be seated in the thermal distribution assembly 3000 suchthat the second component is at least co-planar, and in some casessub-flush, with respect to the third layer 3006. Also, the component3010 may be representative of one or more components, such as anaforementioned heat-generating component, an audio module, a bracket, ora joint, as non-limiting examples. Alternatively, the component 3010 mayinclude a thermally conductive layer designed to receive (and therebydissipate) thermal energy from the thermal distribution assembly 3000.

FIG. 46 illustrates an isometric view of an alternative embodiment of athermal distribution assembly 3100, in accordance with some describedembodiments. The thermal distribution assembly 3100 may include anymaterial(s) and/or feature(s) previously described for a thermaldistribution assembly. As shown, the thermal distribution assembly 3100may include a first layer 3102, a second layer 3104, and a third layer3106, with the second layer 3104 positioned between the first layer 3102and the third layer 3106.

In some embodiments, the second layer 3104 includes a metal, such ascopper. In the embodiment shown in FIG. 46, the second layer 3104includes graphite. In order to bond the second layer 3104 with the firstlayer 3102 and the third layer 3106, the thermal distribution assembly3100 may undergo a welding operation. For example, as shown in FIG. 46,the thermal distribution assembly 3100 includes several welds, such as afirst weld 3112 and a second weld 3114, both being representative ofseveral welds between the first layer 3102 and the second layer 3104.Also, the thermal distribution assembly 3100 may include several weldsbetween the third layer 3106 and the second layer 3104, as representedby a third weld 3116. By welding the second layer 3104 with the firstlayer 3102 and the third layer 3106, the second layer 3104 may resistshear forces that would otherwise displace the second layer 3104 withrespect to the first layer 3102 and the third layer 3106, particularlywhen the second layer 3104 includes a granular material, such asgraphite.

FIG. 47 illustrates a flowchart 3200 showing a method for forming adisplay assembly for an electronic device, in accordance with somedescribed embodiments. The electronic device may include a portableelectronic device, such as a mobile wireless communication device thatincludes a smartphone or a wearable electronic device.

In step 3202, a display layer is positioned between a touch sensitivelayer and a force sensitive layer. The touch sensitive layer isconfigured to detect a touch input that controls the electronic device.The force sensitive layer is configured to detect an amount of forceapplied to the touch sensitive layer. Each of the display layer, thetouch sensitive layer, and the force sensitive layer may include an edgeregion that includes at least one connector. Moreover, some edge regionshaving a connector(s) may be perpendicular or parallel to other edgeregions. For example, the touch sensitive layer may include an edgeregion with a connector, and the display layer may include edge regionwith a connector, with the aforementioned edge regions being parallel,or at least substantially parallel, with respect to one another.Further, the force sensitive layer may include an edge region thatincludes a connector. However, the edge region of the force sensitivelayer may be perpendicular, or at least substantially perpendicular,with respect to the edge region of the display layer and/or the edgeregion of the touch sensitive layer.

In step 3204, the display layer is bent such that the display layerleast partially curves around the force sensitive layer. In someinstances, the display layer is pre-bent. Also, the edge region of thedisplay (that carries the connector) may be separated from a majorportion of the display layer. The major portion of the display layerrefers a surface that defines a substantial majority of the displaylayer, while a minor portion of the display layer refers to a portionthat is separated from the major portion by the bend. The edge regionhaving the connector may be located on, or carried by, the minorportion.

FIG. 48 illustrates a flowchart 3300 showing a method for forming abattery assembly for an electronic device, in accordance with somedescribed embodiments. The battery assembly may be used to supplyelectrical current to several internal components (such as integratedcircuits, audio modules, cameras, lighting elements, etc.) located inthe electronic device.

In step 3302, a housing is provided. The housing is designed to providean enclosure to several components of the battery. The housing mayinclude a first cover element that is sealed with a second coverelement, subsequent to the components being positioned between the firstcover element and the second cover element. Also, the housing may takethe form of one of several different shapes. In this regard, the housingmay include an L-shaped configuration, an I-shaped configuration, or aC-shaped configuration (as non-limiting examples), based upon the shapeof the electrodes and the separators. Moreover, any of theseaforementioned configurations may include an opening, or through hole,designed to accommodate, or provide space for, an internal component ofthe electronic device.

In step 3304, multiple electrodes are inserted into the housing. Themultiple electrodes may include pairs of anodes and cathodes. Also, eachpair of electrodes is separated by a separator that physically isolatesthe electrode pairs from each other, while still allowing the flow ofelectrical charge between the electrode pairs. Also, each electrode mayundergo a die cutting operation to form the electrodes with a particularsize and shape. The size and shape may include a size and shape inaccordance with the housing. In this regard, each electrode in anelectrode pair may include an L-shape, a C-shape, or an I-shape, asnon-limiting examples. Moreover, each separator and each electrode in anelectrode pair may include an opening when the housing also includes theaforementioned opening, in order to provide a through hole in thebattery assembly.

In step 3306, a channel is formed in the housing. The channel may definea reduced dimension in the housing. In this regard, the housing may(substantially) include a first height. However, in a locationcorresponding to the channel, the housing may include a second heightthat is less than the first height. The channel is designed to lower theprofile of the battery assembly such that an additional component (suchas a flexible circuit) can readily pass over the battery along thechannel. In this regard, the channel may allow repositioned of theadditional component in the electronic device. However, the housing ofthe battery can still receive components, such as a circuit board, in alocation corresponding to (or within) the channel.

FIG. 49 illustrates a flowchart 3400 showing a method for method forforming a circuit board assembly, in accordance with some describedembodiments. The circuit board assembly is designed to carry severaloperational components. The circuit board assembly may include a stackedconfiguration in which a first circuit board is stacked or a secondcircuit board, or alternatively, the second circuit board is overlaid bythe first circuit board. When positioned in an enclosure, or housing, ofan electronic device, the stacked configuration may reduce the overallspace (in multiple dimensions) occupied by the circuit board assembly.

In step 3402, a first circuit board is provided. The first circuit boardmay include a first operational component. The first operationalcomponent includes a recess. Also, the first circuit board may includemultiple (opposing) surfaces, with each surface designed to carrymultiple operational components, some of which are in electricalcommunication with each other by way of metal traces and/or a via.

In step 3404, a second circuit is secured with the first circuit boardsuch that the first circuit overlays the second circuit board. Thesecond circuit board may include a second operational component having aprotrusion.

In step 3406, the protrusion of the second operational component ispositioned in (or at least partially positioned in) the recess. In thismatter, the first operational component is “mated” with the secondoperational component by way of the recess and the protrusion. This mayreduce a gap between the first circuit board and the second circuitboard, as the first operational component and the second operationalcomponent are positioned closer to each other, as opposed to operationalcomponents that cannot mate with one another. As a result, the circuitboard assembly may include a lower profile and occupy less space in anelectronic device.

FIG. 50 illustrates a flowchart 3500 showing a method for assembling anelectronic device that includes an enclosure that defines an internalvolume, in accordance with some described embodiments. The enclosure mayinclude a through hole that opens to the internal volume. In step 3502,an audio module is disposed in the internal volume. The audio module mayinclude an audio module housing that carries a diaphragm. The audiomodule may further include an audio module opening formed in the audiomodule housing and aligned with the through hole. Also, with theexception of the audio module opening, the audio module housing may befree of additional openings, or alternatively, may include an opening(or openings) covered by an airtight and liquid-tight seal such that theaudio module housing defines an acoustic volume (including a front andback volume) that is maintained separately from air inside the internalvolume defined by the enclosure.

In step 3504, a bracket is positioned around a portion of audio modulehousing. For example, the bracket may at least partially surround aportion of the audio module housing associated with the audio moduleopening, thereby providing additional support to the audio modulehousing. Also, the bracket may adhesively secure with the enclosure ator near the through hole. The adhesive used to secure the bracket to theenclosure may include a liquid-resistant adhesive.

In step 3506, a sealing element seals the bracket against the enclosureat the through hole. The sealing element may be positioned between thebracket and the enclosure, and may also engage the bracket and theenclosure. In this regard, the audio module housing is sealed from airin the internal volume, and may seal the diaphragm from the air in theinternal volume. Further, the audio module housing is positioned anddesigned to receive or emit air from an external environment outside theelectronic device, such as air entering the through hole. Also, usingthe diaphragm, the audio module can emit acoustical energy that exitsthe audio module opening and the through hole.

FIG. 51 illustrates a flowchart 3600 showing a method for making athermal distribution assembly for removing thermal energy from aheat-generating component in an electronic device having an enclosuresidewall, in accordance with some described embodiments. The thermaldistribution assembly is designed to provide structural support to theelectronic device, in particular when a glass bottom wall coupled to theenclosure sidewall defines an enclosure of the electronic device.

In step 3602, a first layer is secured with a second layer. The firstlayer may include a first bottom wall and a first sidewall extendingfrom the first bottom wall. The second layer may include a second bottomwall engaging the first bottom wall. Also, the second layer may furtherinclude a second sidewall extending from the second bottom wall andengaging the first sidewall. In some instances, the first layer includesa first type material, such as steel (including stainless steel) inorder to provide structural support. Also, in some instances, the secondlayer includes a second type material, such as copper or graphite,designed to enhance thermal conductivity of the thermal distributionassembly. Also, the first and second layer may each include anadditional sidewall.

In step 3604, a third layer is secured with the second layer. The thirdlayer may include a third bottom wall engaging the second bottom wall.The third layer may further include a third sidewall extending from thethird bottom wall and engaging the second sidewall and the enclosuresidewall. The third layer may include a third type material, such assteel (including stainless steel). In this regard, the third layer maycombine with the first layer to provide additional structural support.Also, the first layer and the third layer may fully cover the secondlayer such that the second layer is hidden from view by the first layerand the third layer.

When the thermal distribution assembly is assembled and positioned inthe electronic device, the first layer is designed distribute thermalenergy from the heat-generating component to the second layer. Also, thesecond layer is designed distribute the thermal energy throughoutvarious locations of the second layer, such that the thermal energyreaches the third layer and can be distributed to the enclosuresidewall.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. A circuit board assembly for an electronicdevice, the circuit board assembly comprising: a first circuit boardhaving a first mounting surface and a second surface opposite the firstsurface; a first operational component located on the second mountingsurface of the first circuit board, the first operational componentcomprising an integrated circuit and having a recess; a second circuitboard electrically coupled to the first circuit board, the secondcircuit board having a first mounting surface and a second mountingsurface opposite the first mounting surface; a second operationalcomponent located on the first mounting surface of the second circuitboard, the second operational component comprising an integrated circuitand having a protrusion, wherein the first circuit board is positionedwith respect to the second circuit board such that the protrusion atleast partially extends into the recess; a first interposer positionedbetween and electrically coupled with the first circuit board and thesecond circuit board; a second interposer positioned between andelectrically coupled with the first circuit board and the second circuitboard; and a solder mask between the first interposer and the secondinterposer, the solder mask preventing an electrical coupling betweenthe first interposer and the second interposer.
 2. The circuit boardassembly of claim 1, further comprising: a first connector located inthe recess; and a second connector located on the protrusion, whereinthe first connector is electrically and mechanically coupled to thesecond connector to electrically couple the first circuit board to thesecond circuit board.
 3. The circuit board assembly of claim 1, whereinthe second mounting surface of the first circuit board faces the firstmounting surface of the second circuit board to define a stacked circuitboard assembly.
 4. The circuit board assembly of claim 1, furthercomprising a third operational component located on the second mountingsurface of the first circuit board, the third operational componentelectrically coupled with at least one of the first operationalcomponent and the second operational component.
 5. The circuit boardassembly of claim 1, further comprising shielding elements that providean electromagnetic interference (EMI) shield, the shielding elementscomprising: a first shielding element that covers the first mountingsurface of the first circuit board; a second shielding element extendingaround a gap between the first circuit board and the second circuitboard; and a third shielding element that covers the second mountingsurface of the second circuit board.
 6. The circuit board assembly ofclaim 1, further comprising a potting material disposed between thefirst circuit board and the second circuit board, the potting materialcovering the first operational component and the second operationalcomponent.
 7. An electronic device, comprising: an enclosure thatdefines an internal volume; and a stacked circuit board assemblydisposed in the internal volume, the stacked circuit board assemblycomprising: a first circuit board that carries a first operationalcomponent on a first mounting surface, the first circuit board furthercarrying a second operational component on a second mounting surfacethat is opposite the first mounting surface, wherein the secondoperational component comprises a recess, and a second circuit boardthat is overlaid by the first circuit board, the second circuit boardcarrying a third operational component on a third mounting surface thatfaces the second mounting surface, wherein the third operationalcomponent comprises a protrusion that at least partially extends intothe recess, wherein the second operational component and the thirdoperational component each comprise an integrated circuit; and a batteryassembly disposed in the internal volume, the battery assembly includingan L-shaped configuration such that the battery assembly accommodatesthe stacked circuit board assembly in the internal volume.
 8. Theelectronic device of claim 7, wherein the stacked circuit board assemblycomprises an L-shaped configuration.
 9. The electronic device of claim7, wherein the stacked circuit board assembly further comprises: a firstshielding element that covers the first circuit board and provides afirst electromagnetic interference (EMI) shield for the firstoperational component, and a second shielding element positioned betweenthe first circuit board and the second circuit board, the secondshielding element providing a second EMI shield for the secondcomponent.
 10. The electronic device of claim 7, further comprising aflexible circuit that forms a loop and electrically couples to the firstcircuit board and the second circuit board.
 11. The electronic device ofclaim 7, further comprising a potting material disposed between thefirst circuit board and the second circuit board.
 12. The electronicdevice of claim 7, wherein the first circuit board is secured with thesecond circuit board by a standoff and a rivet coupled with thestandoff.
 13. A method for forming a circuit board assembly, the methodcomprising: providing a first circuit board that includes a firstoperational component, the first operational component comprising anintegrated circuit and having a recess formed therein; and securing asecond circuit board to the first circuit board in a stackedconfiguration such that the first circuit overlays the second circuitboard, the second circuit board including a second operational componentcomprising an integrated circuit and having a protrusion formed thereon,wherein the protrusion is at least partially positioned in the recess inthe stacked configuration; positioning an interposer between the firstcircuit board and the second circuit board; electrically coupling theinterposer with the first circuit board and the second circuit board;positioning a second interposer between the first circuit board and thesecond circuit board, the second interposer electrically coupled to thefirst circuit board and the second circuit board; and positioning asolder mask between the interposer and the second interposer, the soldermask preventing an electrical coupling between the interposer and thesecond interposer.
 14. The method of claim 13, further comprising:securing a standoff between the first circuit board and the secondcircuit board; and positioning a shielding element around a gap betweenthe first circuit board and the second circuit board, the gap having adimension at least partially defined by the standoff.
 15. The method ofclaim 13, wherein securing the second circuit board to the first circuitboard comprises electrically coupling the first component to the secondcomponent.
 16. The method of claim 13, further comprising disposing apotting material between the first circuit board and the second circuitboard, the potting material providing the first operational componentand the second operational component with a shield against a liquid.